Specification	22-4513-10T

Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	200 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Features	Closed Frame
Grid Columns	11
Grid Rows	2
Housing Material	Nylon 4/6, Glass Filled, PA46, Polyamide
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	22
Operating Temperature (Max)	105 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Row Spacing	0.4 in
Termination	Solder
Type	DIP, 0.4" (10.16mm) Row Spacing

513 Series

Part	Row Spacing	Type	Contact Finish - Post	Housing Material	Pitch - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Contact Material - Post	Contact Material - Mating	Mounting Type	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Contact Finish - Mating	Contact Finish Thickness - Post	Features	Termination	Pitch - Post	Contact Finish Thickness - Mating	Material Flammability Rating	Current Rating	Termination Post Length
Aries Electronics 24-3503-31	0.3 in	0.3" (7.62mm) Row Spacing DIP	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	125 °C	-55 °C	Phosphor Bronze	Beryllium Copper	Through Hole	2	24	12	Gold	10 µin	Closed Frame	Wire Wrap	0.1 in	10 µin
Aries Electronics 10-6513-10	0.6 in	0.6" (15.24mm) Row Spacing DIP	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	105 °C	-55 °C	Brass	Beryllium Copper	Through Hole	2	10	5	Gold	200 µin	Closed Frame	Solder	0.1 in	10 µin
Aries Electronics 16-6513-10	0.6 in	0.6" (15.24mm) Row Spacing DIP	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	105 °C	-55 °C	Brass	Beryllium Copper	Through Hole	2	16	8	Gold	200 µin	Closed Frame	Solder	0.1 in	10 µin
Aries Electronics 32-9513-10	0.9 in	0.9" (22.86mm) Row Spacing DIP	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	105 °C	-55 °C	Brass	Beryllium Copper	Through Hole	2	32	16	Gold	200 µin	Closed Frame	Solder	0.1 in	10 µin	UL94 V-0	3 A	0.125 in
Aries Electronics 10-2513-10	0.2 in	0.2" (5.08mm) Row Spacing DIP	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	105 °C	-55 °C	Brass	Beryllium Copper	Through Hole	2	10	5	Gold	200 µin	Closed Frame	Solder	0.1 in	10 µin	UL94 V-0	3 A	0.125 in
Aries Electronics 10-9513-10	0.9 in	0.9" (22.86mm) Row Spacing DIP	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	105 °C	-55 °C	Brass	Beryllium Copper	Through Hole	2	10	5	Gold	200 µin	Closed Frame	Solder	0.1 in	10 µin
Aries Electronics 24-3513-10H	0.3 in	0.3" (7.62mm) Row Spacing DIP	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	105 °C	-55 °C	Brass	Beryllium Copper	Through Hole	2	24	12	Gold	200 µin	Closed Frame	Solder	0.1 in	10 µin	UL94 V-0	3 A	0.125 in
Aries Electronics 36-3513-10H	0.3 in	0.3" (7.62mm) Row Spacing DIP	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	105 °C	-55 °C	Brass	Beryllium Copper	Through Hole	2	36	18	Gold	200 µin	Closed Frame	Solder	0.1 in	10 µin	UL94 V-0	3 A	0.125 in
Aries Electronics 12-6503-31	0.6 in	0.6" (15.24mm) Row Spacing DIP	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	125 °C	-55 °C	Phosphor Bronze	Beryllium Copper	Through Hole	2	12 count	6 count	Gold	10 µin	Closed Frame	Wire Wrap	0.1 in	10 µin
Aries Electronics 36-6513-11H	0.6 in	0.6" (15.24mm) Row Spacing DIP	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	105 °C	-55 °C	Brass	Beryllium Copper	Through Hole	2	36	18	Gold	10 µin	Closed Frame	Solder	0.1 in	10 µin	UL94 V-0	3 A	0.125 in

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22-4513-10T | Datasheet