22-4513 Series

Catalog

CONN IC DIP SOCKET 22POS GOLD

Part	Number of Positions or Pins (Grid)	Pitch - Mating	Pitch - Mating	Features	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Housing Material	Contact Material - Post [custom]	Contact Material - Mating	Pitch - Post	Pitch - Post	Termination	Operating Temperature [Max]	Operating Temperature [Min]	Contact Finish - Post	Type	Type	Type	Current Rating (Amps)	Material Flammability Rating	Mounting Type	Termination Post Length	Termination Post Length	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Aries Electronics 22-4513-10	22	0.1 in	2.54 mm	Closed Frame	10 çin	0.25 çm	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	Beryllium Copper	2.54 mm	0.1 in	Solder	105 ░C	-55 °C	Tin	0.4 in	10.16 mm	DIP	3 A	UL94 V-0	Through Hole	3.18 mm	0.125 in	200 µin	5.08 µm
Aries Electronics 22-4513-10H	22	0.1 in	2.54 mm	Closed Frame	10 çin	0.25 çm	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	Beryllium Copper	2.54 mm	0.1 in	Solder	105 ░C	-55 °C	Tin	0.4 in	10.16 mm	DIP	3 A	UL94 V-0	Through Hole	3.18 mm	0.125 in	200 µin	5.08 µm
Aries Electronics 22-4513-11	22	0.1 in	2.54 mm	Closed Frame	10 çin	0.25 çm	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	Beryllium Copper	2.54 mm	0.1 in	Solder	105 ░C	-55 °C	Gold	0.4 in	10.16 mm	DIP	3 A	UL94 V-0	Through Hole	3.18 mm	0.125 in	10 çin	0.25 çm
Aries Electronics 22-4513-11H	22	0.1 in	2.54 mm	Closed Frame	10 çin	0.25 çm	Gold	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	Beryllium Copper	2.54 mm	0.1 in	Solder	105 ░C	-55 °C	Gold	0.4 in	10.16 mm	DIP	3 A	UL94 V-0	Through Hole	3.18 mm	0.125 in	10 çin	0.25 çm