513 Series

Catalog

IC & COMPONENT SOCKETS LO-PRO FILE COLLET WIRE WRAP 24 PINS

Part	Row Spacing	Type	Contact Finish - Post	Housing Material	Pitch - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Contact Material - Post	Contact Material - Mating	Mounting Type	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Contact Finish - Mating	Contact Finish Thickness - Post	Features	Termination	Pitch - Post	Contact Finish Thickness - Mating	Material Flammability Rating	Current Rating	Termination Post Length
Aries Electronics 24-3503-31	0.3 in	0.3" (7.62mm) Row Spacing DIP	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	125 °C	-55 °C	Phosphor Bronze	Beryllium Copper	Through Hole	2	24	12	Gold	10 µin	Closed Frame	Wire Wrap	0.1 in	10 µin
Aries Electronics 10-6513-10	0.6 in	0.6" (15.24mm) Row Spacing DIP	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	105 °C	-55 °C	Brass	Beryllium Copper	Through Hole	2	10	5	Gold	200 µin	Closed Frame	Solder	0.1 in	10 µin
Aries Electronics 16-6513-10	0.6 in	0.6" (15.24mm) Row Spacing DIP	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	105 °C	-55 °C	Brass	Beryllium Copper	Through Hole	2	16	8	Gold	200 µin	Closed Frame	Solder	0.1 in	10 µin
Aries Electronics 32-9513-10	0.9 in	0.9" (22.86mm) Row Spacing DIP	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	105 °C	-55 °C	Brass	Beryllium Copper	Through Hole	2	32	16	Gold	200 µin	Closed Frame	Solder	0.1 in	10 µin	UL94 V-0	3 A	0.125 in
Aries Electronics 10-2513-10	0.2 in	0.2" (5.08mm) Row Spacing DIP	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	105 °C	-55 °C	Brass	Beryllium Copper	Through Hole	2	10	5	Gold	200 µin	Closed Frame	Solder	0.1 in	10 µin	UL94 V-0	3 A	0.125 in
Aries Electronics 10-9513-10	0.9 in	0.9" (22.86mm) Row Spacing DIP	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	105 °C	-55 °C	Brass	Beryllium Copper	Through Hole	2	10	5	Gold	200 µin	Closed Frame	Solder	0.1 in	10 µin
Aries Electronics 24-3513-10H	0.3 in	0.3" (7.62mm) Row Spacing DIP	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	105 °C	-55 °C	Brass	Beryllium Copper	Through Hole	2	24	12	Gold	200 µin	Closed Frame	Solder	0.1 in	10 µin	UL94 V-0	3 A	0.125 in
Aries Electronics 36-3513-10H	0.3 in	0.3" (7.62mm) Row Spacing DIP	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	105 °C	-55 °C	Brass	Beryllium Copper	Through Hole	2	36	18	Gold	200 µin	Closed Frame	Solder	0.1 in	10 µin	UL94 V-0	3 A	0.125 in
Aries Electronics 12-6503-31	0.6 in	0.6" (15.24mm) Row Spacing DIP	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	125 °C	-55 °C	Phosphor Bronze	Beryllium Copper	Through Hole	2	12 count	6 count	Gold	10 µin	Closed Frame	Wire Wrap	0.1 in	10 µin
Aries Electronics 36-6513-11H	0.6 in	0.6" (15.24mm) Row Spacing DIP	Gold	Glass Filled Nylon 4/6 PA46 Polyamide	0.1 in	105 °C	-55 °C	Brass	Beryllium Copper	Through Hole	2	36	18	Gold	10 µin	Closed Frame	Solder	0.1 in	10 µin	UL94 V-0	3 A	0.125 in