Specification	C1812R335K3RACTU

Applications	Decoupling, Boardflex Sensitive, Bypass
Capacitance	3.3 µF
Features	Soft Termination, High Temperature
Mounting Type	Surface Mount, MLCC
Operating Temperature (Max)	175 °C
Operating Temperature (Min)	-55 °C
Package / Case	1812 (4532 Metric)
Size / Dimension Length	0.177 in
Size / Dimension Width	0.126 in
Temperature Coefficient	X7R
Thickness (Max)	0.083 in
Tolerance	10 %
Voltage - Rated	25 VAC

SMD Indust X7R HT175C Series

Part	Mounting Type	Tolerance	Size / Dimension Width	Size / Dimension Length	Thickness (Max)	Voltage - Rated	Capacitance	Package / Case	Temperature Coefficient	Applications	Features	Operating Temperature (Max)	Operating Temperature (Min)
KEMET C0603G104K5RACTU	MLCC Surface Mount	10 %	0.031 in	0.063 in	0.034 in	50 V	0.1 µF	0603 (1608 Metric)	X7R	Bypass Decoupling General Purpose	High Temperature	175 °C	-55 °C
KEMET C0805R684K3RACTU	MLCC Surface Mount	10 %	0.049 in	0.079 in	0.055 in	25 VAC	0.68 µF	0805 (2012 Metric)	X7R	Boardflex Sensitive Bypass Decoupling	High Temperature Soft Termination	175 °C	-55 °C
KEMET C1210R225K3RACTU	MLCC Surface Mount	10 %	0.102 in	0.13 in	0.091 in	25 VAC	2.2 µF	1210 (3225 Metric)	X7R	Boardflex Sensitive Bypass Decoupling	High Temperature Soft Termination	175 °C	-55 °C
KEMET C1812R335K3RACTU	MLCC Surface Mount	10 %	0.126 in	0.177 in	0.083 in	25 VAC	3.3 µF	1812 (4532 Metric)	X7R	Boardflex Sensitive Bypass Decoupling	High Temperature Soft Termination	175 °C	-55 °C

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