PSMNR56-25YLEX
ActiveNexperia USA Inc.
N-CHANNEL 25 V, 0.63 MOHM, ASFET FOR HOTSWAP WITH ENHANCED SOA IN LFPAK56E
PSMNR56-25YLEX
ActiveNexperia USA Inc.
N-CHANNEL 25 V, 0.63 MOHM, ASFET FOR HOTSWAP WITH ENHANCED SOA IN LFPAK56E
Description
General part information
PSMNR56-25YLE Series
N-channel enhancement mode ASFET for hotswap with enhanced SOA in LFPAK56E package optimized for low RDSonand strong safe operating area, optimized for hot-swap, inrush and linear-mode applications.
Technical Specifications
Parameters and characteristics for this part
| Specification | PSMNR56-25YLEX |
|---|---|
| Current - Continuous Drain (Id) (Tc) | 320 A |
| Drain to Source Voltage (Vdss) | 25 V |
| Drive Voltage (Max Rds On) | 7 V |
| Drive Voltage (Min Rds On) | 10 V |
| FET Type | N-Channel |
| Gate Charge (Max) | 190 nC |
| Input Capacitance (Ciss) (Max) | 12137 pF |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 175 °C |
| Operating Temperature (Min) | -55 °C |
| Package / Case | 4-LFPAK, SOT-1023 |
| Package Name | LFPAK56, Power-SO8 |
| Power Dissipation (Max) | 333 W |
| Rds On (Max) | 0.63 mOhm |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) | 2.2 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Reflow soldering profile
plastic, single-ended surface-mounted package (LFPAK56E); 4 leads; 1.27 mm pitch
Nexperia package poster
Low temperature soldering, application study
Maximum continuous currents in NEXPERIA LFPAK power MOSFETs
plastic, single-ended surface-mounted package (LFPAK56); 4 leads; 1.27 mm pitch; 4.58 mm x 5.13 mm x 1.03 mm body
Power MOSFETs in linear mode
Questions about package outline drawings
LFPAK56; Reel pack for SMD, 7"; Q1/T1 product orientation