Specification	XA3S1600E-4FGG400I

Grade	Automotive
Mounting Type	Surface Mount
Number of Gates	1600000
Number of I/O	304
Number of LABs/CLBs	3688
Number of Logic Elements/Cells	33192
Operating Temperature (Max)	100 °C
Operating Temperature (Min)	-40 °C
Package / Case	400-BGA
Package Length	21 mm
Package Name	400-FBGA
Package Width	21 mm
Qualification	AEC-Q100
Total RAM Bits	663552 bits
Voltage - Supply (Maximum)	1.26 V
Voltage - Supply (Minimum)	1.14 V

XA3S1600 Series

Part	Grade	Package / Case	Mounting Type	Number of Logic Elements/Cells	Number of Gates	Package Name	Package Width	Package Length	Qualification	Total RAM Bits	Number of LABs/CLBs	Voltage - Supply (Minimum)	Voltage - Supply (Maximum)	Operating Temperature (Max)	Operating Temperature (Min)	Number of I/O
AMD / Xilinx XA3S1600E-4FGG400I	Automotive	400-BGA	Surface Mount	33192	1600000	400-FBGA	21 mm	21 mm	AEC-Q100	663552 bits	3688	1.14 V	1.26 V	100 °C	-40 °C	304
AMD / Xilinx XA3S1600E-4FGG484I	Automotive	484-BBGA	Surface Mount	33192	1600000	484-FBGA	23 mm	23 mm	AEC-Q100	663552 bits	3688	1.14 V	1.26 V	100 °C	-40 °C	376
AMD / Xilinx XA3S1600E-4FGG484Q	Automotive	484-BBGA	Surface Mount	33192	1600000	484-FBGA	23 mm	23 mm	AEC-Q100	663552 bits	3688	1.14 V	1.26 V	125 °C	-40 °C	376
AMD / Xilinx XA3S1600E-4FGG400Q	Automotive	400-BGA	Surface Mount	33192	1600000	400-FBGA	21 mm	21 mm	AEC-Q100	663552 bits	3688	1.14 V	1.26 V	125 °C	-40 °C	304

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