
BUK7M67-60EX
ActiveNexperia USA Inc.
N-CHANNEL 60 V, 67 MΩ STANDARD LEVEL MOSFET IN LFPAK33

BUK7M67-60EX
ActiveNexperia USA Inc.
N-CHANNEL 60 V, 67 MΩ STANDARD LEVEL MOSFET IN LFPAK33
Description
General part information
BUK7M67-60E Series
Standard level N-channel MOSFET in an LFPAK33 (Power33) package using TrenchMOS technology. This product has been designed and qualified to AEC Q101 standard for use in high performance automotive applications.
Technical Specifications
Parameters and characteristics for this part
| Specification | BUK7M67-60EX |
|---|---|
| Current - Continuous Drain (Id) (Tc) | 14 A |
| Drain to Source Voltage (Vdss) | 60 V |
| Drive Voltage (Max Rds On, Min Rds On) | 10 V |
| FET Type | N-Channel |
| Gate Charge (Max) | 6.7 nC |
| Grade | Automotive |
| Input Capacitance (Ciss) (Max) | 334 pF |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 175 °C |
| Operating Temperature (Min) | -55 °C |
| Package / Case | 8-LFPAK33 (5-Lead), SOT-1210 |
| Package Name | LFPAK33 |
| Power Dissipation (Max) | 31 W |
| Qualification | AEC-Q101 |
| Rds On (Max) | 67 mOhm |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) | 4 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Datasheet
RC Thermal Models
Understanding power MOSFET data sheet parameters
Using power MOSFETs in parallel
LFPAK33 shrinking the power footprint
Power MOSFET single-shot and repetitive avalanche ruggedness rating
Failure signature of Electrical Overstress on Power MOSFETs
BUK7M67-60E Thermal design model
Designing RC Snubbers
LFPAK33; Reel pack for SMD, 7"; Q1/T1 product orientation
LFPAK33 leaflet
Plastic, single ended surface mounted package (LFPAK33); 8 leads; 0.65 mm pitch; 2.7 mm x 3.4 mm x 0.9 mm body
Plastic, single ended surface mounted package (LFPAK33); 8 leads; 0.65 mm pitch
Using Power MOSFET Zth Curves
Power MOSFET frequently asked questions and answers
Reflow soldering profile
Nexperia package poster
Questions about package outline drawings