BAS21QB-QZ
ObsoleteNexperia USA Inc.
DIODE STD 200V 250MA DFN1110D3
BAS21QB-QZ
ObsoleteNexperia USA Inc.
DIODE STD 200V 250MA DFN1110D3
Description
General part information
BAS21QB-Q Series
High-voltage switching diode, encapsulated in an ultra small DFN1110D-3 (SOT8015, JEDEC MO340-BA) leadless Surface-Mounted Device (SMD) plastic package with side-wettable flanks.
Technical Specifications
Parameters and characteristics for this part
| Specification | BAS21QB-QZ |
|---|---|
| Capacitance | 5 pF |
| Current - Average Rectified (Io) | 250 mA |
| Current - Reverse Leakage | 100 nA |
| Grade | Automotive |
| Mounting Type | Wettable Flank, Surface Mount |
| Operating Temperature - Junction | 150 °C |
| Package / Case | 3-XDFN Exposed Pad |
| Package Name | DFN1110D-3 |
| Qualification | AEC-Q101 |
| Reverse Recovery Time (trr) | 50 ns |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Standard |
| Voltage - DC Reverse (Vr) (Max) | 200 V |
| Voltage - Forward (Vf) (Max) | 1.25 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
BAS21QB-QZ | Datasheet
BAS21QB-Q Nexperia Product Reliability
Thermal performance of DFN packages
DFN1110D-3; Reel pack for SMD, 7"; Q2/T3 product orientation
Reflow soldering profile
Low temperature soldering, application study
Thermal performance of DFN packages
plastic, leadless extremely thin small outline package with side-wettable flanks (SWF); 3 terminals; 0.65 mm pitch; 1.1 mm x 1 mm x 0.48 mm body
Small & light automotive diodes and transistors
小巧轻便的汽车 二极管和晶体管