
PMEG2020EPAS-QX
ActiveNexperia USA Inc.
20 V, 2 A LOW VF SCHOTTKY BARRIER RECTIFIER

PMEG2020EPAS-QX
ActiveNexperia USA Inc.
20 V, 2 A LOW VF SCHOTTKY BARRIER RECTIFIER
Description
General part information
PMEG2020EPAS-Q Series
Planar Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with visible and solderable side pads.
Technical Specifications
Parameters and characteristics for this part
| Specification | PMEG2020EPAS-QX |
|---|---|
| Capacitance | 175 pF |
| Current - Average Rectified (Io) | 2 A |
| Current - Reverse Leakage | 1.9 mA |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction | 150 °C |
| Package / Case | 3-UDFN Exposed Pad |
| Package Name | DFN2020D-3 |
| Qualification | AEC-Q101 |
| Reverse Recovery Time (trr) | 50 ns |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 20 V |
| Voltage - Forward (Vf) (Max) | 420 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Thermal performance of DFN packages
plastic, leadless thermal enhanced ultra thin small outline package with side-wettable flanks (SWF); no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body
小巧轻便的汽车 二极管和晶体管
Nexperia package poster
Thermal performance of DFN packages
DFN2020D-3; Reel pack for SMD, 7"; Q2/T3 product orientation
PMEG2020EPAS-Q Nexperia Product Reliability
Reflow soldering profile
plastic, thermal enhanced ultra thin small outline package; no leads; 3 terminals; 1.3 mm pitch; 2 mm x 2 mm x 0.65 mm body
Small & light automotive diodes and transistors
PMEG2020EPAS-QX | Datasheet