RCJ700N20TL
ActiveRohm Semiconductor
MOSFET, N-CH, 200V, 70A, 150DEG C, 297W
RCJ700N20TL
ActiveRohm Semiconductor
MOSFET, N-CH, 200V, 70A, 150DEG C, 297W
Description
General part information
RCJ700N20 Series
Power MOSFETs are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications. Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.
Technical Specifications
Parameters and characteristics for this part
| Specification | RCJ700N20TL |
|---|---|
| Current - Continuous Drain (Id) (Tc) | 70 A |
| Drain to Source Voltage (Vdss) | 200 V |
| Drive Voltage (Max Rds On, Min Rds On) | 10 V |
| FET Type | N-Channel |
| Gate Charge (Max) | 125 nC, 125 nC |
| Input Capacitance (Ciss) (Max) | 6900 pF |
| Mounting Type | Surface Mount |
| Operating Temperature | 150 °C |
| Package / Case | D2PAK (2 Leads + Tab), TO-263-3, TO-263AB |
| Package Name | LPTS |
| Power Dissipation (Max) | 1.56 W, 40 W |
| Rds On (Max) | 42.7 mOhm |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 30 V |
| Vgs(th) (Max) | 5 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
What is a Thermal Model? (Transistor)
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
How to Use LTspice® Models: Tips for Improving Convergence
Types and Features of Transistors
Part Explanation
How to Create Symbols for PSpice Models
About Flammability of Materials
Two-Resistor Model for Thermal Simulation
Method for Monitoring Switching Waveform
Package Dimensions
How to Use LTspice® Models
Basics of Thermal Resistance and Heat Dissipation
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Compliance of the RoHS directive
Power Eco Family: Overview of ROHM's Power Semiconductor Lineup
What Is Thermal Design
Inner Structure
MOSFET Gate Drive Current Setting for Motor Driving
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Report of SVHC under REACH Regulation
Judgment Criteria of Thermal Evaluation
Anti-Whisker formation - Transistors
Impedance Characteristics of Bypass Capacitor
Notes for Temperature Measurement Using Thermocouples
List of Transistor Package Thermal Resistance
Calculation of Power Dissipation in Switching Circuit
Notes for Temperature Measurement Using Forward Voltage of PN Junction
ESD Data
Precautions When Measuring the Rear of the Package with a Thermocouple
Explanation for Marking
Condition of Soldering / Land Pattern Reference
MOSFET Gate Resistor Setting for Motor Driving
Moisture Sensitivity Level - Transistors
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Reliability Test Result
PCB Layout Thermal Design Guide
About Export Regulations
Measurement Method and Usage of Thermal Resistance RthJC
RCJ700N20 Data Sheet
Temperature derating method for Safe Operating Area (SOA)
Taping Information
Notes for Calculating Power Consumption:Static Operation
Importance of Probe Calibration When Measuring Power: Deskew
θ<sub>JA</sub> and Ψ<sub>JT</sub>