TSM-138-02-F-DV-A

Active

Samtec Inc.

CONN HEADER SMD 76POS 2.54MM

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet

TSM-138-02-F-DV-A

Active

Samtec Inc.

CONN HEADER SMD 76POS 2.54MM

Deep-Dive with AI

DocumentsDatasheet

Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	TSM-138-02-F-DV-A

Connector Type	Cuttable, Header
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	3 µin
Contact Finish Thickness - Mating	0.076 µm
Contact Length - Mating	8.13 mm
Contact Length - Mating	0.32 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Fastening Type	Push-Pull
Features	Board Guide
Insulation Color	Black
Insulation Height	0.1 in
Insulation Height	2.54 mm
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Positions	76
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Row Spacing - Mating [x]	2.54 mm
Row Spacing - Mating [x]	0.1 in
Shrouding	Unshrouded
Style	Board to Board, Cable
Termination	Solder

TSM-138 Series

Part	Mounting Type	Connector Type	Style	Fastening Type	Insulation Material	Insulation Height	Insulation Height	Insulation Color	Operating Temperature [Max]	Operating Temperature [Min]	Number of Positions	Material Flammability Rating	Number of Rows	Contact Finish - Post	Contact Length - Mating	Contact Length - Mating	Shrouding	Pitch - Mating	Pitch - Mating	Termination	Contact Material	Features	Contact Shape	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Number of Positions Loaded	Contact Type	Contact Length - Mating [x]	Contact Length - Mating [x]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating
Samtec Inc. TSM-138-04-T-DV-A	Surface Mount	Cuttable Header	Board to Board Cable	Push-Pull	Liquid Crystal Polymer (LCP)	0.1 in	2.54 mm	Black	105 ░C	-55 °C	76	UL94 V-0	2	Tin	3.05 mm	0.12 in	Unshrouded	0.1 in	2.54 mm	Solder	Phosphor Bronze	Board Guide	Square	2.54 mm	0.1 in	All	Male Pin
Samtec Inc. TSM-138-02-TL-DV	Surface Mount	Cuttable Header	Board to Board Cable	Push-Pull	Liquid Crystal Polymer (LCP)	0.1 in	2.54 mm	Black	105 ░C	-55 °C	76	UL94 V-0	2	Tin	8.13 mm	0.32 in	Unshrouded	0.1 in	2.54 mm	Solder	Phosphor Bronze		Square	2.54 mm	0.1 in	All	Male Pin
Samtec Inc. TSM-138-05-S-DV-A	Surface Mount	Cuttable Header	Board to Board Cable	Push-Pull	Liquid Crystal Polymer (LCP)	0.1 in	2.54 mm	Black	125 °C	-55 °C	76	UL94 V-0	2	Tin			Unshrouded	0.1 in	2.54 mm	Solder	Phosphor Bronze	Board Guide	Square	2.54 mm	0.1 in	All	Male Pin	1.9 mm	0.075 in	30 Áin	0.76 Ám	Gold
Samtec Inc. TSM-138-04-L-DV-A	Surface Mount	Cuttable Header	Board to Board Cable	Push-Pull	Liquid Crystal Polymer (LCP)	0.1 in	2.54 mm	Black	125 °C	-55 °C	76	UL94 V-0	2	Tin	3.05 mm	0.12 in	Unshrouded	0.1 in	2.54 mm	Solder	Phosphor Bronze	Board Guide	Square	2.54 mm	0.1 in	All	Male Pin			10 çin	0.25 çm	Gold
Samtec Inc. TSM-138-01-L-DV	Surface Mount	Cuttable Header	Board to Board Cable	Push-Pull	Liquid Crystal Polymer (LCP)	0.1 in	2.54 mm	Black	125 °C	-55 °C	76	UL94 V-0	2	Tin	5.84 mm		Unshrouded	0.1 in	2.54 mm	Solder	Phosphor Bronze		Square	2.54 mm	0.1 in	All	Male Pin		0.23 in	10 çin	0.25 çm	Gold
Samtec Inc. TSM-138-02-F-DV-A	Surface Mount	Cuttable Header	Board to Board Cable	Push-Pull	Liquid Crystal Polymer (LCP)	0.1 in	2.54 mm	Black	125 °C	-55 °C	76	UL94 V-0	2	Tin	8.13 mm	0.32 in	Unshrouded	0.1 in	2.54 mm	Solder	Phosphor Bronze	Board Guide	Square	2.54 mm	0.1 in	All	Male Pin			3 µin	0.076 µm	Gold
Samtec Inc. TSM-138-01-S-DV-A	Surface Mount	Cuttable Header	Board to Board Cable	Push-Pull	Liquid Crystal Polymer (LCP)	0.1 in	2.54 mm	Black	125 °C	-55 °C	76	UL94 V-0	2	Tin	5.84 mm		Unshrouded	0.1 in	2.54 mm	Solder	Phosphor Bronze	Board Guide	Square	2.54 mm	0.1 in	All	Male Pin		0.23 in	30 Áin	0.76 Ám	Gold
Samtec Inc. TSM-138-01-STL-DV	Surface Mount	Cuttable Header	Board to Board Cable	Push-Pull	Liquid Crystal Polymer (LCP)	0.1 in	2.54 mm	Black	125 °C	-55 °C	76	UL94 V-0	2	Tin	5.84 mm		Unshrouded	0.1 in	2.54 mm	Solder	Phosphor Bronze		Square	2.54 mm	0.1 in	All	Male Pin		0.23 in	30 Áin	0.76 Ám	Gold
Samtec Inc. TSM-138-01-F-DV-A	Surface Mount	Cuttable Header	Board to Board Cable	Push-Pull	Liquid Crystal Polymer (LCP)	0.1 in	2.54 mm	Black	125 °C	-55 °C	76	UL94 V-0	2	Tin	5.84 mm		Unshrouded	0.1 in	2.54 mm	Solder	Phosphor Bronze	Board Guide	Square	2.54 mm	0.1 in	All	Male Pin		0.23 in	3 µin	0.076 µm	Gold
Samtec Inc. TSM-138-02-L-DV-A	Surface Mount	Cuttable Header	Board to Board Cable	Push-Pull	Liquid Crystal Polymer (LCP)	0.1 in	2.54 mm	Black	125 °C	-55 °C	76	UL94 V-0	2	Tin	8.13 mm	0.32 in	Unshrouded	0.1 in	2.54 mm	Solder	Phosphor Bronze	Board Guide	Square	2.54 mm	0.1 in	All	Male Pin			10 çin	0.25 çm	Gold

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	6	$ 6.63

Description

General part information

TSM-138 Series

Connector Header Surface Mount 76 position 0.100" (2.54mm)

Documents

Technical documentation and resources