Specification	550-10-100-15-001101

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	10 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Contact Resistance	10 mOhm
Current Rating	1 A
Features	Open Frame
Grid Columns	15
Grid Rows	15
Housing Material	PCT, Polycyclohexylenedimethylene Terephthalate, Glass Filled, Polyester
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	100
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.164 in
Type	PGA

550-10 Series

Part	Type	Contact Finish - Post	Contact Finish Thickness - Post	Pitch - Post	Housing Material	Contact Finish - Mating	Mounting Type	Termination	Contact Material - Post	Pitch - Mating	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Operating Temperature (Max)	Operating Temperature (Min)	Features	Contact Finish Thickness - Mating	Contact Material - Mating	Material Flammability Rating	Contact Resistance	Current Rating	Termination Post Length
Preci-Dip 550-10-256M20-001152	BGA	Gold	10 µin	0.05 in	FR4 Epoxy Glass	Gold	Through Hole	Solder	Brass	0.05 in	20	256	20	125 °C	-55 °C	Closed Frame	10 µin	Brass	UL94 V-0	10 mOhm	1 A	0.086 in
Preci-Dip 550-10-361-18-101135	PGA	Gold	10 µin	0.05 in	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Gold	Through Hole	Solder	Brass	0.05 in	18	361	18	125 °C	-55 °C	Open Frame	10 µin	Beryllium Copper	UL94 V-0	10 mOhm	1 A	0.126 in
Preci-Dip 550-10-381-18-101135	PGA	Gold	10 µin	0.05 in	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Gold	Through Hole	Solder	Brass	0.05 in	18	381	18	125 °C	-55 °C	Open Frame	10 µin	Beryllium Copper	UL94 V-0	10 mOhm	1 A	0.126 in
Preci-Dip 550-10-068-10-061101	PGA	Gold	10 µin	0.1 in	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Gold	Through Hole	Solder	Brass	0.1 in	10	68	10	125 °C	-55 °C	Open Frame	10 µin	Beryllium Copper	UL94 V-0	10 mOhm	1 A	0.164 in
Preci-Dip 550-10-272M20-001166	BGA	Gold	10 µin	0.05 in	FR4 Epoxy Glass	Gold	Through Hole	Solder	Brass	0.05 in	20	272	20	125 °C	-55 °C	Closed Frame	10 µin	Beryllium Copper	UL94 V-0	10 mOhm	1 A	0.098 in
Preci-Dip 550-10-520M31-001152	BGA	Gold	10 µin	0.05 in	FR4 Epoxy Glass	Gold	Through Hole	Solder	Brass	0.05 in	31	520	31	125 °C	-55 °C	Closed Frame	10 µin	Brass	UL94 V-0	10 mOhm	1 A	0.086 in
Preci-Dip 550-10-272M20-001152	BGA	Gold	10 µin	0.05 in	FR4 Epoxy Glass	Gold	Through Hole	Solder	Brass	0.05 in	20	272	20	125 °C	-55 °C	Closed Frame	10 µin	Brass	UL94 V-0	10 mOhm	1 A	0.086 in
Preci-Dip 550-10-037-10-061101	PGA	Gold	10 µin	0.1 in	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Gold	Through Hole	Solder	Brass	0.1 in	10	37 count	10	125 °C	-55 °C	Open Frame	10 µin	Beryllium Copper	UL94 V-0	10 mOhm	1 A	0.164 in
Preci-Dip 550-10-504M29-001152	BGA	Gold	10 µin	0.05 in	FR4 Epoxy Glass	Gold	Through Hole	Solder	Brass	0.05 in	29	504	29	125 °C	-55 °C	Closed Frame	10 µin	Brass	UL94 V-0	10 mOhm	1 A	0.086 in
Preci-Dip 550-10-100-15-001101	PGA	Gold	10 µin	0.1 in	Glass Filled PCT Polycyclohexylenedimethylene Terephthalate Polyester	Gold	Through Hole	Solder	Brass	0.1 in	15	100	15	125 °C	-55 °C	Open Frame	10 µin	Beryllium Copper	UL94 V-0	10 mOhm	1 A	0.164 in

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