Specification	LPC55S66JEV59Y

A/D Channels	10 count
A/D Resolution (bits)	16 bit
Connectivity	USB, SPI, I2C, USART, UART, SD, Flexcomm, SDIO, MMC
Converter Architecture	SAR
Core Processor	ARM® Cortex®-M33F
Core Size (Bit Width)	32 Bit
Mounting Type	Surface Mount
Number of I/O	37
Operating Temperature (Max)	105 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	Internal, External
Package / Case	59-VFBGA
Package Length	4 mm
Package Name	59-VFBGA
Package Width	4 mm
Peripherals	DMA, Brown-out Detect, AES, POR, TRNG, I2S, PWM, Reset, WDT
Program Memory Depth	256 K
Program Memory Size	256 KB
Program Memory Type	FLASH
Program Memory Width	8 bit
RAM Size Depth	144 K
RAM Size Width	8 bit
Speed	150 MHz
Voltage - Supply (Vcc/Vdd) Maximum	3.6 V
Voltage - Supply (Vcc/Vdd) Minimum	1.8 V

LPC55S6x Series

Part	RAM Size Width	RAM Size Depth	Operating Temperature (Max)	Operating Temperature (Min)	Package / Case	A/D Channels	Converter Architecture	A/D Resolution (bits)	Core Processor	Speed	Mounting Type	Program Memory Width	Program Memory Depth	Program Memory Size	Program Memory Type	Number of I/O	Package Name	Package Width	Package Length	Core Size (Bit Width)	Peripherals	Voltage - Supply (Vcc/Vdd) Maximum	Voltage - Supply (Vcc/Vdd) Minimum	Connectivity	Oscillator Type
NXP USA Inc. LPC55S66JEV59Y	8 bit	144 K	105 °C	-40 °C	59-VFBGA	10 count	SAR	16 bit	ARM® Cortex®-M33F	150 MHz	Surface Mount	8 bit	256 K	256 KB	FLASH	37	59-VFBGA	4 mm	4 mm	32 Bit	AES Brown-out Detect DMA I2S POR PWM Reset TRNG WDT	3.6 V	1.8 V	Flexcomm I2C MMC SD SDIO SPI UART USART USB	External Internal

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