74LVC06APW-Q100J

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Nexperia USA Inc.

HEX INVERTER WITH OPEN-DRAIN OUTPUTS

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74LVC06APW-Q100J

Active

Nexperia USA Inc.

HEX INVERTER WITH OPEN-DRAIN OUTPUTS

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Description Specifications Series Pricing CAD Documents

Description

General part information

74LVC06APW-Q100 Series

The 74LVC06A-Q100 provides six inverting buffers. The outputs are open-drain and can be connected to other open-drain outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions.

Technical Specifications

Parameters and characteristics for this part

Specification	74LVC06APW-Q100J

Current - Output Low	32 mA
Current - Quiescent (Max)	10 µA
Features	Open Drain
Grade	Automotive
Input Logic Level - High (Max)	2 V
Input Logic Level - High (Min)	1.08 V
Input Logic Level - Low (Max)	0.8 V
Input Logic Level - Low (Min)	0.12 V
Logic Type	Inverter
Max CL	50 pF
Max Propagation Delay	2.5 ns
Mounting Type	Surface Mount
Number of Circuits	6
Number of Inputs	1
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Package Length	0.173 in
Package Name	14-TSSOP
Package Width	4.4 mm
Qualification	AEC-Q100
Voltage - Supply (Maximum)	5.5 V
Voltage - Supply (Minimum)	1.2 V

74LVC06APW-Q100 Series

Hex inverter with open-drain outputs

Part	Max Propagation Delay	Max CL	Operating Temperature (Max)	Operating Temperature (Min)	Logic Type	Qualification	Package Name	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)	Mounting Type	Features	Current - Quiescent (Max)	Package Width	Package Length	Input Logic Level - High (Max)	Input Logic Level - High (Min)	Input Logic Level - Low (Max)	Input Logic Level - Low (Min)	Grade	Number of Circuits	Number of Inputs	Current - Output Low
Nexperia USA Inc. 74LVC06APW-Q100J	2.5 ns	50 pF	125 °C	-40 °C	Inverter	AEC-Q100	14-TSSOP	5.5 V	1.2 V	Surface Mount	Open Drain	10 µA	4.4 mm	0.173 in	2 V	1.08 V	0.8 V	0.12 V	Automotive	6	1	32 mA

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet

Footprint for wave soldering

plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.2 mm body

TSSOP14; Reel pack for SMD, 13"; Q1/T1 product orientation

plastic, thin shrink small outline package; 14 leads; 0.65 mm pitch; 5 mm x 4.4 mm x 1.1 mm body

Pin FMEA for LVC family

Nexperia package poster

74LVC06APW-Q100 Nexperia Product Reliability