PMEG3030EP,115
ActiveNexperia USA Inc.
30 V, 3 A LOW VF SCHOTTKY BARRIER RECTIFIER
PMEG3030EP,115
ActiveNexperia USA Inc.
30 V, 3 A LOW VF SCHOTTKY BARRIER RECTIFIER
Description
General part information
PMEG3030EP Series
Planar Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package.
Technical Specifications
Parameters and characteristics for this part
| Specification | PMEG3030EP,115 |
|---|---|
| Capacitance | 470 pF |
| Current - Average Rectified (Io) | 3 A |
| Current - Reverse Leakage | 5 mA |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction (Max) | 150 °C |
| Package / Case | SOD-128 |
| Package Name | SOD-128/CFP5 |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 30 V |
| Voltage - Forward (Vf) (Max) | 360 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Wave soldering profile
CFP封装的肖特基整流器
PMEG3030EP Nexperia Product Reliability
Schottky rectifiers in CFP packages
plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body
Nexperia package poster
Reel pack for SMD, 7''; Q1/T1-Q2/T3 product orientation
Thermal consideration of NXP FlatPower MEGA Schottky barrier rectifiers - Selection criteria
Wave soldering guidelines for flatpack packages
Questions about package outline drawings
Evaluation of junction temperature and thermal stacks using the virtual junction
Reflow soldering profile
plastic, surface mounted package; 2 terminals; 4 mm pitch; 3.8 mm x 2.6 mm x 1 mm body