Specification	MC9S08SH32MTJ

A/D Channels	12 count
A/D Resolution (bits)	10 bit
Connectivity	I2C, SPI, LINbus, SCI
Core Processor	S08
Core Size (Bit Width)	8 Bit
Mounting Type	Surface Mount
Number of I/O	17
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	Internal
Package Length	0.173 in
Package Name	20-TSSOP
Package Width	4.4 mm
Peripherals	WDT, PWM, POR, LVD
Program Memory Depth	32 K
Program Memory Size	32 KB
Program Memory Type	FLASH
Program Memory Width	8 bit
RAM Size Depth	1 K
RAM Size Width	8 bit
Speed	40 MHz
Voltage - Supply (Vcc/Vdd) Maximum	5.5 V
Voltage - Supply (Vcc/Vdd) Minimum	2.7 V

S08SH Series

Part	Oscillator Type	Operating Temperature (Max)	Operating Temperature (Min)	Connectivity	Core Size (Bit Width)	Number of I/O	Voltage - Supply (Vcc/Vdd) Minimum	Voltage - Supply (Vcc/Vdd) Maximum	Mounting Type	Peripherals	Program Memory Type	Package Name	RAM Size Depth	RAM Size Width	Program Memory Depth	Program Memory Width	Program Memory Size	A/D Channels	A/D Resolution (bits)	Speed	Core Processor	Package Length	Package Width
NXP USA Inc. MC9S08SH8MTJ	Internal	125 °C	-40 °C	I2C LINbus SCI SPI	8 Bit	17	2.7 V	5.5 V	Surface Mount	LVD POR PWM WDT	FLASH	20-TSSOP	512	8 bit	8 K	8 bit	8 KB	12 count	10 bit	40 MHz	S08	0.173 in	4.4 mm
NXP USA Inc. MC9S08SH32MTJ	Internal	125 °C	-40 °C	I2C LINbus SCI SPI	8 Bit	17	2.7 V	5.5 V	Surface Mount	LVD POR PWM WDT	FLASH	20-TSSOP	1 K	8 bit	32 K	8 bit	32 KB	12 count	10 bit	40 MHz	S08	0.173 in	4.4 mm
NXP USA Inc. MC9S08SH4CTGR	Internal	85 °C	-40 °C	I2C LINbus SCI SPI	8 Bit		2.7 V	5.5 V	Surface Mount	LVD POR PWM WDT	FLASH	16-TSSOP	256	8 bit	4 K	8 bit	4 KB	8 count	10 bit	40 MHz	S08	0.173 in	4.4 mm

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