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TPH5900CNH,L1Q

TPH5900CNH,L1Q

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Toshiba Semiconductor and Storage

12V - 300V MOSFETS, N-CH MOSFET, 150 V, 0.059 Ω@10V, SOP ADVANCE, U-MOSⅧ-H

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TPH5900CNH,L1Q

TPH5900CNH,L1Q

Active
Toshiba Semiconductor and Storage

12V - 300V MOSFETS, N-CH MOSFET, 150 V, 0.059 Ω@10V, SOP ADVANCE, U-MOSⅧ-H

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Description

General part information

TPH5900CNH Series

12V - 300V MOSFETs, N-ch MOSFET, 150 V, 0.059 Ω@10V, SOP Advance, U-MOSⅧ-H

Technical Specifications

Parameters and characteristics for this part

SpecificationTPH5900CNH,L1Q
Current - Continuous Drain (Id) (Ta)9 A
Drain to Source Voltage (Vdss)150 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Max)7 nC
Input Capacitance (Ciss) (Max)600 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerVDFN
Package Length5 mm
Package Name8-SOP Advance
Package Width5 mm
Power Dissipation (Max)1.6 W, 42 W
Rds On (Max)59 mOhm
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max)4 V

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

TPH5900CNH,L1Q | Datasheet
Quick Reference Guide for Thermal Design for Discrete Semiconductor Devices
Reverse Recovery Operation and Destruction of MOSFET Body Diode
MOSFET SPICE model grade
Selecting MOSFETs and Consideration for Circuit Design: Power MOSFET Application Notes
Simplified CFD Model Application Note
Electrical Characteristics: Power MOSFET Application Notes
Parasitic Oscillation between Parallel Power MOSFETs: Power MOSFET Application Notes
Efficiency Evaluation and Loss Analysis of 300W isolated DC-DC converter
Structures and Characteristics: Power MOSFET Application Notes
U-MOSⅨ-H 60V Low VDS spike TPH1R306P1
MOSFET Self-Turn-On Phenomenon
Selection Guide MOSFETs 2025 Rev1.0
Impacts of the dv/dt Rate on MOSFETs: Power MOSFET Application Notes
Calculating the Temperature of Discrete Semiconductor Devices
Quick Reference Guide for Thermal Design for Power Semiconductor SMD type: Part 2
RC Snubbers for Step-Down Converters
Hints and Tips for Thermal Design for Discrete Semiconductor Devices
Discrete Semiconductor Devices Hints and Tips for Thermal Design Part 2
Avalanche energy calculation
Efficiency evaluation of Half-bridge DC-DC converter supporting 48V Bus system
Thermal Design and Attachment of a Thermal Fin: Power MOSFET Application Notes
Hints and Tips for Thermal Design part3
MOSFET Gate Drive Circuit: Power MOSFET Application Notes
Resonant Circuits and Soft Switching
Derating of the MOSFET Safe Operating Area
MOSFET Avalanche Ruggedness: Power MOSFET Application Notes
MOSFET Secondary Breakdown
Maximum Ratings: Power MOSFET Application Notes
Parasitic Oscillation and Ringing: Power MOSFET Application Notes
Motor Control (Vacuum Cleaners)
TPH5900CNH Data sheet/Japanese