
MGM210PA32JIA2
ActiveSILICON LABS
MULTIPROTOCOL MODULES WIRELESS GECKO MULTI-PROTOCOL MODULE, +20 DBM, 2.4 GHZ, 1 MB FLASH, -40 TO 125 C, BUILT-IN ANTENNA, CERTIFIED.

MGM210PA32JIA2
ActiveSILICON LABS
MULTIPROTOCOL MODULES WIRELESS GECKO MULTI-PROTOCOL MODULE, +20 DBM, 2.4 GHZ, 1 MB FLASH, -40 TO 125 C, BUILT-IN ANTENNA, CERTIFIED.
Description
General part information
MGM210 Series
802.15.4, Bluetooth Bluetooth v5.3, Thread, Zigbee® Transceiver Module 2.4GHz ~ 2.4835GHz Integrated, Chip Surface Mount
Technical Specifications
Parameters and characteristics for this part
| Specification | MGM210PA32JIA2 |
|---|---|
| Antenna Type | Chip, Integrated |
| Current - Receiving (Max) | 9.9 mA |
| Current - Receiving (Min) | 9.1 mA |
| Current - Transmitting (Max) | 181.3 mA |
| Current - Transmitting (Min) | 59.7 mA |
| Data Rate | 2 Mbps |
| Frequency (Max) | 2.4835 GHz |
| Frequency (Min) | 2.4 GHz |
| Memory Size (Flash) | 1 MB |
| Memory Size (RAM) | 96 kB |
| Memory Size (SRAM) | 96 kB |
| Memory Type | RAM, Flash, SRAM |
| Modulation | DSSS, O-QPSK, GFSK |
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 125 °C |
| Operating Temperature (Min) | -40 °C |
| Package / Case | 31-SMD Module |
| Power - Output | 20 dBm |
| Protocol | Zigbee®, Bluetooth v5.3, Thread |
| RF Family/Standard | 802.15.4, Bluetooth |
| Sensitivity | -104.5 dBm |
| Serial Interfaces | ADC, I2S, I2C, IrDA, SPI, UART, PWM, GPIO |
| Utilized IC / Part | EFR32MG21 |
| Voltage - Supply (Maximum) | 3.8 V |
| Voltage - Supply (Minimum) | 1.71 V |
Pricing
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CAD
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Documents
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