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MGM210PA32JIA2

MGM210PA32JIA2

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SILICON LABS

MULTIPROTOCOL MODULES WIRELESS GECKO MULTI-PROTOCOL MODULE, +20 DBM, 2.4 GHZ, 1 MB FLASH, -40 TO 125 C, BUILT-IN ANTENNA, CERTIFIED.

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MGM210PA32JIA2

MGM210PA32JIA2

Active
SILICON LABS

MULTIPROTOCOL MODULES WIRELESS GECKO MULTI-PROTOCOL MODULE, +20 DBM, 2.4 GHZ, 1 MB FLASH, -40 TO 125 C, BUILT-IN ANTENNA, CERTIFIED.

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Description

General part information

MGM210 Series

802.15.4, Bluetooth Bluetooth v5.3, Thread, Zigbee® Transceiver Module 2.4GHz ~ 2.4835GHz Integrated, Chip Surface Mount

Technical Specifications

Parameters and characteristics for this part

SpecificationMGM210PA32JIA2
Antenna TypeChip, Integrated
Current - Receiving (Max)9.9 mA
Current - Receiving (Min)9.1 mA
Current - Transmitting (Max)181.3 mA
Current - Transmitting (Min)59.7 mA
Data Rate2 Mbps
Frequency (Max)2.4835 GHz
Frequency (Min)2.4 GHz
Memory Size (Flash)1 MB
Memory Size (RAM)96 kB
Memory Size (SRAM)96 kB
Memory TypeRAM, Flash, SRAM
ModulationDSSS, O-QPSK, GFSK
Mounting TypeSurface Mount
Operating Temperature (Max)125 °C
Operating Temperature (Min)-40 °C
Package / Case31-SMD Module
Power - Output20 dBm
ProtocolZigbee®, Bluetooth v5.3, Thread
RF Family/Standard802.15.4, Bluetooth
Sensitivity-104.5 dBm
Serial InterfacesADC, I2S, I2C, IrDA, SPI, UART, PWM, GPIO
Utilized IC / PartEFR32MG21
Voltage - Supply (Maximum)3.8 V
Voltage - Supply (Minimum)1.71 V

Pricing

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CAD

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Documents

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