SMD4300AX500T4C

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Chip Quik Inc.

SOLDER PASTE 63/37 T4 500G

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Chip Quik Inc.

SOLDER PASTE 63/37 T4 500G

Technical Specifications

Parameters and characteristics commom to parts in this series

Specification	SMD4300AX500T4C	SMD4300 Series

Composition	-	Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Flux Type	Water Soluble, No-Clean	Water Soluble, No-Clean
Form	500 g, 17.64 oz	17.64 - 500 g
Form	Cartridge	Cartridge, Jar, 8.8 oz (250g)
Melting Point [custom]	361 °F	280 - 361 °F
Melting Point [custom]	183 °C	138 - 183 °C
Mesh Type [custom]	4	4
Process	Leaded	Leaded
Shelf Life	12 Months	6 - 12 Months
Shelf Life Start	Date of Manufacture	Date of Manufacture
Shipping Info	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.
Storage/Refrigeration Temperature	-	77 °F
Storage/Refrigeration Temperature	-	0 °C
Type	Solder Paste	Solder Paste

SOLDER PASTE 63/37 T4 500G

Part	Shelf Life Start	Shipping Info	Shelf Life	Type	Flux Type	Form	Form	Process	Melting Point [custom]	Melting Point [custom]	Mesh Type [custom]	Storage/Refrigeration Temperature [Max]	Storage/Refrigeration Temperature [Min]	Composition
Chip Quik Inc. SMD4300AX500T4C	Date of Manufacture	Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended.	12 Months	Solder Paste	No-Clean, Water Soluble	17.64 oz, 500 g	Cartridge	Leaded	361 °F	183 °C	4
Chip Quik Inc. SMD4300LTLFP250T4	Date of Manufacture		6 Months	Solder Paste	No-Clean, Water Soluble		Jar, 8.8 oz (250g)		280 °F	138 °C		77 °F	0 °C	Bi57.6Sn42Ag0.4 (57.6/42/0.4)

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 97.50

General part information

Leaded No-Clean, Water Soluble Solder Paste Sn63Pb37 (63/37) Cartridge, 17.64 oz (500g)

Technical documentation and resources