04-0501-20

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Aries Electronics

CONN SOCKET SIP 4POS TIN

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Aries Electronics

CONN SOCKET SIP 4POS TIN

Technical Specifications

Parameters and characteristics for this part

Specification	04-0501-20

Contact Finish - Post	Tin
Contact Finish Thickness - Mating	5.08 µm
Contact Finish Thickness - Mating	200 µin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Phosphor Bronze
Contact Material - Post	Phosphor Bronze
Current Rating (Amps)	1 A
Housing Material	Glass Filled, Polyamide (PA46), Nylon 4/6
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	4
Number of Positions or Pins (Grid) [custom]	1 x 4
Operating Temperature [Max]	105 ░C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.1 in
Pitch - Mating	2.54 mm
Pitch - Post	2.54 mm
Pitch - Post	0.1 in
Termination	Wire Wrap
Termination Post Length	0.42 in
Termination Post Length	10.67 mm
Type	SIP

CONN SOCKET SIP 4POS TIN

Part	Termination Post Length	Termination Post Length	Termination	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Mounting Type	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Housing Material	Pitch - Post	Pitch - Post	Operating Temperature [Max]	Operating Temperature [Min]	Pitch - Mating	Pitch - Mating	Current Rating (Amps)	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post	Contact Material - Mating	Type
Aries Electronics 04-0501-20	0.42 in	10.67 mm	Wire Wrap	4	1 x 4	Through Hole	Tin	5.08 µm	200 µin	Glass Filled, Nylon 4/6, Polyamide (PA46)	2.54 mm	0.1 in	105 ░C	-55 °C	0.1 in	2.54 mm	1 A	UL94 V-0	200 µin	5.08 µm	Phosphor Bronze	Phosphor Bronze	SIP

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	137	$ 3.70

General part information

4 (1 x 4) Pos SIP Socket Tin Through Hole

Technical documentation and resources