.25MIC 3M676XW TPC DISC 22.5"

Obsolete

LAPPING FILM DIAMOND 0.25U 22.5"

Obsolete

LAPPING FILM DIAMOND 0.25U 22.5"

Description

General part information

Lapping Film Diamond 0.25µ X 22.50" (571.50mm) Dia

Parameters and characteristics for this part

Specification	.25MIC 3M676XW TPC DISC 22.5"

Abrasive Material	Diamond
Applications	Fiber Optic Connector Polishing
Diameter	22.5 in
Micron Size	0.25 µm
Type	Lapping Film

Part	Abrasive Material	Diameter	Applications	Type	Micron Size
3M Electronic Specialty .25MIC 3M676XW TPC DISC 22.5"	Diamond	22.5 in	Fiber Optic Connector Polishing	Lapping Film	0.25 µm

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