74LVC1G125GM,115
ActiveNexperia USA Inc.
BUFFER / LINE DRIVER, 74LVC1G125, 1 ELEMENT, 1.65 V TO 5.5 V, 6 PINS, XSON
74LVC1G125GM,115
ActiveNexperia USA Inc.
BUFFER / LINE DRIVER, 74LVC1G125, 1 ELEMENT, 1.65 V TO 5.5 V, 6 PINS, XSON
Description
General part information
74LVC1G125GM Series
The 74LVC1G125 is a single buffer/line driver with 3-state output. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments.
Technical Specifications
Parameters and characteristics for this part
| Specification | 74LVC1G125GM,115 |
|---|---|
| Current - Output High | 32 mA |
| Current - Output Low | 32 mA |
| Logic Type | Buffer, Non-Inverting |
| Mounting Type | Surface Mount |
| Number of Bits per Element | 1 bits |
| Number of Elements | 1 |
| Operating Temperature (Max) | 125 °C |
| Operating Temperature (Min) | -40 °C |
| Output Type | 3-State |
| Package / Case | 6-XFDFN |
| Package Length | 1.45 mm |
| Package Name | 6-XSON, SOT886 |
| Package Width | 1 mm |
| Voltage - Supply (Maximum) | 5.5 V |
| Voltage - Supply (Minimum) | 1.65 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body
PicoGate Logic footprints
XSON6; Reel pack for SMD, 7''; Q3/T4 product orientation
MAR_SOT886 Topmark
Pin FMEA for LVC family
plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body
plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body
Reflow soldering profile
XSON6; Reel pack for SMD, 7''; Q1/T1 product orientation
74LVC1G125GM Nexperia Product Reliability
Nexperia package poster
MicroPak leadless logic portfolio guide