Specification	SS-131-TT-2-N

Connector Type	Receptacle
Contact Finish - Mating	Tin
Contact Finish - Post	Tin
Contact Length - Post	0.125 in
Contact Material	Beryllium Copper
Contact Shape	Circular
Contact Type	Female Socket
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.1 in
Insulation Material	Polybutylene Terephthalate (PBT), Glass Filled
Mounting Type	Through Hole
Number of Positions	31
Number of Positions Loaded	All
Number of Rows	1
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Style	Board
Termination	Solder

SS-131 Series

Part	Operating Temperature (Max)	Operating Temperature (Min)	Contact Finish Thickness - Mating	Contact Finish - Post	Insulation Color	Number of Positions Loaded	Style	Contact Finish - Mating	Mounting Type	Termination	Number of Rows	Pitch - Mating	Contact Length - Post	Fastening Type	Number of Positions	Insulation Height	Contact Type	Connector Type	Contact Finish Thickness - Post	Insulation Material	Contact Material	Contact Shape
Samtec Inc. SS-118-G-1C	125 °C	-55 °C	30 µin	Gold	Black	All	Board	Gold	Through Hole	Solder	1	0.1 in	0.26 in	Push-Pull	18	0.1 in	Female Socket	Receptacle	10 µin	Glass Filled Polybutylene Terephthalate (PBT)	Beryllium Copper	Circular
Samtec Inc. SS-118-G-3	125 °C	-55 °C	30 µin	Gold	Black	All	Board	Gold	Through Hole	Solder	1	0.1 in	0.123 in	Push-Pull	18	0.1 in	Female Socket	Receptacle	10 µin	Glass Filled Polybutylene Terephthalate (PBT)	Beryllium Copper	Circular
Samtec Inc. SS-118-G-21B	125 °C	-55 °C	30 µin	Gold	Black	All	Board	Gold	Through Hole	Solder	1	0.1 in	0.51 in	Push-Pull	18	0.1 in	Female Socket	Receptacle	10 µin	Glass Filled Polybutylene Terephthalate (PBT)	Beryllium Copper	Circular
Samtec Inc. SS-118-G-22	125 °C	-55 °C	30 µin	Gold	Black	All	Board	Gold	Through Hole	Solder	1	0.1 in	0.125 in	Push-Pull	18	0.1 in	Female Socket	Receptacle	10 µin	Glass Filled Polybutylene Terephthalate (PBT)	Beryllium Copper	Circular
Samtec Inc. SS-118-TT-2-N	125 °C	-55 °C		Tin	Black	All	Board	Tin	Through Hole	Solder	1	0.1 in	0.125 in	Push-Pull	18	0.1 in	Female Socket	Receptacle		Glass Filled Polybutylene Terephthalate (PBT)	Beryllium Copper	Circular
Samtec Inc. SS-118-G-18	125 °C	-55 °C	30 µin	Gold	Black	All	Board	Gold	Through Hole	Solder	1	0.1 in		Push-Pull	18	0.1 in	Female Socket	Receptacle	10 µin	Glass Filled Polybutylene Terephthalate (PBT)	Beryllium Copper	Circular
Samtec Inc. SS-118-T-22	125 °C	-55 °C	30 µin	Tin	Black	All	Board	Gold	Through Hole	Solder	1	0.1 in	0.125 in	Push-Pull	18	0.1 in	Female Socket	Receptacle		Glass Filled Polybutylene Terephthalate (PBT)	Beryllium Copper	Circular
Samtec Inc. SS-118-S-2	125 °C	-55 °C	10 µin	Tin	Black	All	Board	Gold	Through Hole	Solder	1	0.1 in	0.125 in	Push-Pull	18	0.1 in	Female Socket	Receptacle		Glass Filled Polybutylene Terephthalate (PBT)	Beryllium Copper	Circular
Samtec Inc. SS-118-T-21B	125 °C	-55 °C	30 µin	Tin	Black	All	Board	Gold	Through Hole	Solder	1	0.1 in	0.51 in	Push-Pull	18	0.1 in	Female Socket	Receptacle		Glass Filled Polybutylene Terephthalate (PBT)	Beryllium Copper	Circular
Samtec Inc. SS-118-G-2-N	125 °C	-55 °C	30 µin	Gold	Black	All	Board	Gold	Through Hole	Solder	1	0.1 in	0.125 in	Push-Pull	18	0.1 in	Female Socket	Receptacle	10 µin	Glass Filled Polybutylene Terephthalate (PBT)	Beryllium Copper	Circular

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