SS-118 Series
Manufacturer: Samtec Inc.
Beta
⌘K
SOCKET STRIPS
| Part | Operating Temperature (Max) | Operating Temperature (Min) | Contact Finish Thickness - Mating | Contact Finish - Post | Insulation Color | Number of Positions Loaded | Style | Contact Finish - Mating | Mounting Type | Termination | Number of Rows | Pitch - Mating | Contact Length - Post | Fastening Type | Number of Positions | Insulation Height | Contact Type | Connector Type | Contact Finish Thickness - Post | Insulation Material | Contact Material | Contact Shape |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Samtec Inc. | 125 °C | -55 °C | 30 µin | Gold | Black | All | Board | Gold | Through Hole | Solder | 1 | 0.1 in | 0.26 in | Push-Pull | 18 | 0.1 in | Female Socket | Receptacle | 10 µin | Glass Filled Polybutylene Terephthalate (PBT) | Beryllium Copper | Circular |
Samtec Inc. | 125 °C | -55 °C | 30 µin | Gold | Black | All | Board | Gold | Through Hole | Solder | 1 | 0.1 in | 0.123 in | Push-Pull | 18 | 0.1 in | Female Socket | Receptacle | 10 µin | Glass Filled Polybutylene Terephthalate (PBT) | Beryllium Copper | Circular |
Samtec Inc. | 125 °C | -55 °C | 30 µin | Gold | Black | All | Board | Gold | Through Hole | Solder | 1 | 0.1 in | 0.51 in | Push-Pull | 18 | 0.1 in | Female Socket | Receptacle | 10 µin | Glass Filled Polybutylene Terephthalate (PBT) | Beryllium Copper | Circular |
 Samtec Inc. | 125 °C | -55 °C | 30 µin | Gold | Black | All | Board | Gold | Through Hole | Solder | 1 | 0.1 in | 0.125 in | Push-Pull | 18 | 0.1 in | Female Socket | Receptacle | 10 µin | Glass Filled Polybutylene Terephthalate (PBT) | Beryllium Copper | Circular |
 Samtec Inc. | 125 °C | -55 °C | Tin | Black | All | Board | Tin | Through Hole | Solder | 1 | 0.1 in | 0.125 in | Push-Pull | 18 | 0.1 in | Female Socket | Receptacle | Glass Filled Polybutylene Terephthalate (PBT) | Beryllium Copper | Circular | ||
Samtec Inc. | 125 °C | -55 °C | 30 µin | Gold | Black | All | Board | Gold | Through Hole | Solder | 1 | 0.1 in | Push-Pull | 18 | 0.1 in | Female Socket | Receptacle | 10 µin | Glass Filled Polybutylene Terephthalate (PBT) | Beryllium Copper | Circular | |
Samtec Inc. | 125 °C | -55 °C | 30 µin | Tin | Black | All | Board | Gold | Through Hole | Solder | 1 | 0.1 in | 0.125 in | Push-Pull | 18 | 0.1 in | Female Socket | Receptacle | Glass Filled Polybutylene Terephthalate (PBT) | Beryllium Copper | Circular | |
Samtec Inc. | 125 °C | -55 °C | 10 µin | Tin | Black | All | Board | Gold | Through Hole | Solder | 1 | 0.1 in | 0.125 in | Push-Pull | 18 | 0.1 in | Female Socket | Receptacle | Glass Filled Polybutylene Terephthalate (PBT) | Beryllium Copper | Circular | |
Samtec Inc. | 125 °C | -55 °C | 30 µin | Tin | Black | All | Board | Gold | Through Hole | Solder | 1 | 0.1 in | 0.51 in | Push-Pull | 18 | 0.1 in | Female Socket | Receptacle | Glass Filled Polybutylene Terephthalate (PBT) | Beryllium Copper | Circular | |
 Samtec Inc. | 125 °C | -55 °C | 30 µin | Gold | Black | All | Board | Gold | Through Hole | Solder | 1 | 0.1 in | 0.125 in | Push-Pull | 18 | 0.1 in | Female Socket | Receptacle | 10 µin | Glass Filled Polybutylene Terephthalate (PBT) | Beryllium Copper | Circular |