RB501VM-40FHTE-17
ActiveRohm Semiconductor
40V, 100MA, SOD-323FL, SCHOTTKY BARRIER DIODE FOR AUTOMOTIVE
RB501VM-40FHTE-17
ActiveRohm Semiconductor
40V, 100MA, SOD-323FL, SCHOTTKY BARRIER DIODE FOR AUTOMOTIVE
Description
General part information
RB501VM-40FH Series
ROHM's schottky barrier diodes are low VF, low IR and high ESD resistant, suitable for phone and various portable electronics.
Technical Specifications
Parameters and characteristics for this part
| Specification | RB501VM-40FHTE-17 |
|---|---|
| Capacitance | 6 pF |
| Current - Average Rectified (Io) | 100 mA |
| Current - Reverse Leakage | 30 µA |
| Grade | Automotive |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction (Max) | 125 °C |
| Package / Case | SOD-323F, SC-90 |
| Package Name | UMD2 |
| Qualification | AEC-Q101 |
| Speed | Any Speed, Small Signal |
| Speed - Fast Recovery (Maximum) | 200 mA |
| Speed - Small Signal Current Max | 200 mA, 200 mA, 200 mA |
| Technology | Schottky |
| Voltage - DC Reverse (Vr) (Max) | 40 V |
| Voltage - Forward (Vf) (Max) | 550 mV, 550 mV |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Technical Data Sheet EN
About Export Regulations
ROHM's SBD Lineup Contributes to Greater Miniaturization and Lower Loss in Automotive, Industrial, and Consumer Equipment
Judgment Criteria of Thermal Evaluation
Two-Resistor Model for Thermal Simulation
Notes for Temperature Measurement Using Thermocouples
ESD Data
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Condition of Soldering / Land Pattern Reference
What Is Thermal Design
Notes for Calculating Power Consumption:Static Operation
Compliance of the RoHS directive
Reliability Test Result
About Flammability of Materials
Absolute Maximum Rating and Electrical Characteristics of Diodes
Measurement Method and Usage of Thermal Resistance RthJC
Power Loss and Thermal Design of Diodes
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Part Explanation
Basics of Thermal Resistance and Heat Dissipation
Anti-Whisker formation - Diodes
Impedance Characteristics of Bypass Capacitor
List of Diode Package Thermal Resistance
θ<sub>JC</sub> and Ψ<sub>JT</sub>
How to Select Rectifier Diodes
Precautions When Measuring the Rear of the Package with a Thermocouple
How to Create Symbols for PSpice Models
What is a Thermal Model? (Diode)
Inner Structure
Package Dimensions
PCB Layout Thermal Design Guide
How to Select Reverse Current Protection Diodes for LDO Regulators
Diode Selection Method for Asynchronous Converter
Moisture Sensitivity Level - Diodes
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Taping Information
Diode Types and Applications
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Importance of Probe Calibration When Measuring Power: Deskew
How to Use LTspice® Models: Tips for Improving Convergence
Method for Monitoring Switching Waveform
Certificate of not containing SVHC under REACH Regulation
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Explanation for Marking
How to Use LTspice® Models