
RFN3LB6STBR1
ActiveRohm Semiconductor
600V 3A 16NS, DO-214AA(SMB), SUPER FAST RECOVERY DIODE

RFN3LB6STBR1
ActiveRohm Semiconductor
600V 3A 16NS, DO-214AA(SMB), SUPER FAST RECOVERY DIODE
Description
General part information
RFN3LB6S Series
RFN3LB6S is a silicon epitaxial planar type super fast recovery diode featuring low VFand low switching loss. Ideal for general rectification applications.
Technical Specifications
Parameters and characteristics for this part
| Specification | RFN3LB6STBR1 |
|---|---|
| Current - Average Rectified (Io) | 3 A |
| Current - Reverse Leakage | 1 µA |
| Mounting Type | Surface Mount |
| Operating Temperature - Junction | 150 °C |
| Package / Case | SMB, DO-214AA |
| Package Name | SMBP |
| Reverse Recovery Time (trr) | 35 ns |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Standard |
| Voltage - DC Reverse (Vr) (Max) | 600 V |
| Voltage - Forward (Vf) (Max) | 1.75 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Moisture Sensitivity Level - Diodes
Notes for Temperature Measurement Using Forward Voltage of PN Junction
What is a Thermal Model? (Diode)
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Part Explanation
Power Loss and Thermal Design of Diodes
Judgment Criteria of Thermal Evaluation
About Export Regulations
How to Use LTspice® Models
Diode Types and Applications
Precautions When Measuring the Rear of the Package with a Thermocouple
Notes for Calculating Power Consumption:Static Operation
Absolute Maximum Rating and Electrical Characteristics of Diodes
Importance of Probe Calibration When Measuring Power: Deskew
How to Use the Thermal Resistance and Thermal Characteristics Parameters
How to Select Reverse Current Protection Diodes for LDO Regulators
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Measurement Method and Usage of Thermal Resistance RthJC
θ<sub>JA</sub> and Ψ<sub>JT</sub>
About Flammability of Materials
Compliance of the RoHS directive
RFN3LB6S Data Sheet
PCB Layout Thermal Design Guide
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Anti-Whisker formation - Diodes
How to Use LTspice® Models: Tips for Improving Convergence
Method for Monitoring Switching Waveform
What Is Thermal Design
Impedance Characteristics of Bypass Capacitor
List of Diode Package Thermal Resistance
Two-Resistor Model for Thermal Simulation
Notes for Temperature Measurement Using Thermocouples
How to Select Rectifier Diodes
Basics of Thermal Resistance and Heat Dissipation