Specification	MC16Z3BCAG16

A/D Channels	8 count
A/D Resolution (bits)	10 bit
Connectivity	EBI, EMI, SCI, SPI
Core Processor	CPU16
Core Size (Bit Width)	16 Bit
Mounting Type	Surface Mount
Number of I/O	16
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	-40 °C
Oscillator Type	External
Package / Case	144-LQFP
Package Length	20 mm
Package Name	144-LQFP
Package Width	20 mm
Peripherals	WDT, POR, PWM
Program Memory Depth	8 K
Program Memory Size	8 KB
Program Memory Type	Mask ROM
Program Memory Width	8 bit
RAM Size Depth	4 K
RAM Size Width	8 bit
Speed	16 MHz
Voltage - Supply (Vcc/Vdd) Maximum	5.5 V
Voltage - Supply (Vcc/Vdd) Minimum	2.7 V

MC16Z Series

Part	Package Length	Package Name	Package Width	Operating Temperature (Max)	Operating Temperature (Min)	Program Memory Type	Package / Case	Connectivity	A/D Channels	A/D Resolution (bits)	Peripherals	Core Processor	Mounting Type	Core Size (Bit Width)	RAM Size Depth	RAM Size Width	Program Memory Depth	Program Memory Width	Program Memory Size	Voltage - Supply (Vcc/Vdd) Minimum	Voltage - Supply (Vcc/Vdd) Maximum	Oscillator Type	Number of I/O	Speed
NXP USA Inc. MC16Z3BCAG16	20 mm	144-LQFP	20 mm	85 °C	-40 °C	Mask ROM	144-LQFP	EBI EMI SCI SPI	8 count	10 bit	POR PWM WDT	CPU16	Surface Mount	16 Bit	4 K	8 bit	8 K	8 bit	8 KB	2.7 V	5.5 V	External	16	16 MHz
NXP USA Inc. MC16Z3BCAG16	20 mm	144-LQFP	20 mm	85 °C	-40 °C	Mask ROM	144-LQFP	EBI EMI SCI SPI	8 count	10 bit	POR PWM WDT	CPU16	Surface Mount	16 Bit	4 K	8 bit	8 K	8 bit	8 KB	2.7 V	5.5 V	External	16	16 MHz

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