RSQ035P03HZGTR
ActiveRohm Semiconductor
MOSFET, P-CH, -30V, 150DEG C, 1.25W ROHS COMPLIANT: YES
RSQ035P03HZGTR
ActiveRohm Semiconductor
MOSFET, P-CH, -30V, 150DEG C, 1.25W ROHS COMPLIANT: YES
Description
General part information
RSQ035P03HZG Series
RSQ035P03HZG is a MOSFET for switching applications. This is a high-reliability product of automotive grade qualified to AEC-Q101.
Technical Specifications
Parameters and characteristics for this part
| Specification | RSQ035P03HZGTR |
|---|---|
| Current - Continuous Drain (Id) (Ta) | 3.5 A |
| Drain to Source Voltage (Vdss) | 30 V |
| Drive Voltage (Max Rds On) | 4 V |
| Drive Voltage (Min Rds On) | 10 V |
| FET Type | P-Channel |
| Gate Charge (Max) | 9.2 nC |
| Grade | Automotive |
| Input Capacitance (Ciss) (Max) | 780 pF |
| Mounting Type | Surface Mount |
| Operating Temperature | 150 °C |
| Package / Case | TSOT-23-6, SOT-23-6 Thin |
| Package Name | TSMT6 (SC-95) |
| Power Dissipation (Max) | 950 mW |
| Qualification | AEC-Q101 |
| Rds On (Max) | 65 mOhm |
| Technology | MOSFET (Metal Oxide) |
| Vgs (Max) | 20 V |
| Vgs(th) (Max) | 2.5 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Technical Data Sheet EN
Basics of Thermal Resistance and Heat Dissipation
List of Transistor Package Thermal Resistance
Reliability Test Result
What is a Thermal Model? (Transistor)
θ<sub>JC</sub> and Ψ<sub>JT</sub>
About Flammability of Materials
Importance of Probe Calibration When Measuring Power: Deskew
About Export Regulations
Judgment Criteria of Thermal Evaluation
Moisture Sensitivity Level - Transistors
Compliance of the RoHS directive
RSQ035P03HZG ESD Data
How to Use LTspice® Models
Inner Structure
Types and Features of Transistors
How to Create Symbols for PSpice Models
Certificate of not containing SVHC under REACH Regulation
MOSFET Gate Resistor Setting for Motor Driving
What Is Thermal Design
Explanation for Marking
Temperature derating method for Safe Operating Area (SOA)
Two-Resistor Model for Thermal Simulation
How to Use LTspice® Models: Tips for Improving Convergence
Precautions When Measuring the Rear of the Package with a Thermocouple
Measurement Method and Usage of Thermal Resistance RthJC
MOSFET Gate Drive Current Setting for Motor Driving
Part Explanation
Anti-Whisker formation - Transistors
Impedance Characteristics of Bypass Capacitor
Notes for Temperature Measurement Using Forward Voltage of PN Junction
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Method for Monitoring Switching Waveform
Condition of Soldering / Land Pattern Reference
Notes for Calculating Power Consumption:Static Operation
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Notes for Temperature Measurement Using Thermocouples
Package Dimensions
Calculation of Power Dissipation in Switching Circuit
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
TSMT6_TR Taping Information
PCB Layout Thermal Design Guide
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)