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Description

General part information

2324271 Series

LGA 4189, 2092 Position, Surface Mount - Solder Ball, .9906 x .8585 mm [.039 x .0338 in] Grid, Board Mount, LGA Sockets

Technical Specifications

Parameters and characteristics for this part

Specification1-2324271-7
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating15 µin
Contact Finish Thickness - Post15 µin
Contact Material - MatingCopper Alloy
Contact Material - PostCopper Alloy
Current Rating0.5 A
FeaturesOpen Frame
Housing MaterialThermoplastic
Material Flammability RatingUL94 V-0
Mounting TypeSurface Mount
Number of Positions or Pins (Grid)2092 count
Operating Temperature (Max)100 °C
Operating Temperature (Min)-25 °C
Pitch - Mating0.039 in
Pitch - Post0.034 in
TerminationSolder
TypeLGA 4189

Pricing

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CAD

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