W25N02KVTBIU TR
ActiveWinbond Electronics
IC FLASH 2GBIT SPI/QUAD 24TFBGA
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W25N02KVTBIU TR
ActiveWinbond Electronics
IC FLASH 2GBIT SPI/QUAD 24TFBGA
Deep-Dive with AI
DocumentsDatasheet
Technical Specifications
Parameters and characteristics commom to parts in this series
| Specification | W25N02KVTBIU TR | W25N02 Series |
|---|---|---|
| Access Time | 7 ns | 7 - 8 ns |
| Clock Frequency | 104 MHz | 104 - 166 MHz |
| Memory Format | FLASH | FLASH |
| Memory Interface | SPI - Quad I/O | SPI - Quad I/O, DTR, Quad I/O, SPI |
| Memory Organization | 256M x 8 | 256M x 8 |
| Memory Size | 2 Gbit | 2 Gbit |
| Memory Type | Non-Volatile | Non-Volatile |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature [Max] | 85 °C | 85 °C |
| Operating Temperature [Min] | -40 °C | -40 °C |
| Package / Case | 24-TBGA | 24-TBGA, 16-SOIC, 8-WDFN Exposed Pad |
| Package / Case | - | 0.295 in |
| Package / Case | - | 7.5 mm |
| Supplier Device Package | 24-TFBGA (8x6) | 24-TFBGA (8x6), 16-SOIC, 8-WSON (8x6) |
| Technology | FLASH - NAND (SLC) | FLASH - NAND (SLC) |
| Voltage - Supply [Max] | 3.6 V | 1.95 - 3.6 V |
| Voltage - Supply [Min] | 2.7 V | 1.7 - 2.7 V |
| Write Cycle Time - Word, Page | 700 µs | 700 µs |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tape & Reel (TR) | 2000 | $ 3.64 | |
W25N02 Series
IC FLASH 2GBIT SPI/QUAD 24TFBGA
| Part | Memory Interface | Operating Temperature [Max] | Operating Temperature [Min] | Write Cycle Time - Word, Page | Memory Organization | Voltage - Supply [Min] | Voltage - Supply [Max] | Memory Type | Memory Format | Clock Frequency | Technology | Mounting Type | Supplier Device Package | Access Time | Memory Size | Package / Case | Package / Case [x] | Package / Case [y] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics W25N02KVTBIU TR | SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 256M x 8 | 2.7 V | 3.6 V | Non-Volatile | FLASH | 104 MHz | FLASH - NAND (SLC) | Surface Mount | 24-TFBGA (8x6) | 7 ns | 2 Gbit | 24-TBGA | ||
Winbond Electronics W25N02KVSFIR TR | SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 256M x 8 | 2.7 V | 3.6 V | Non-Volatile | FLASH | 104 MHz | FLASH - NAND (SLC) | Surface Mount | 16-SOIC | 7 ns | 2 Gbit | 16-SOIC | 0.295 in | 7.5 mm |
Winbond Electronics W25N02KVTBIU | SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 256M x 8 | 2.7 V | 3.6 V | Non-Volatile | FLASH | 104 MHz | FLASH - NAND (SLC) | Surface Mount | 24-TFBGA (8x6) | 7 ns | 2 Gbit | 24-TBGA | ||
Winbond Electronics W25N02KVZEIR TR | SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 256M x 8 | 2.7 V | 3.6 V | Non-Volatile | FLASH | 104 MHz | FLASH - NAND (SLC) | Surface Mount | 8-WSON (8x6) | 7 ns | 2 Gbit | 8-WDFN Exposed Pad | ||
Winbond Electronics W25N02KVZEIE | SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 256M x 8 | 2.7 V | 3.6 V | Non-Volatile | FLASH | 104 MHz | FLASH - NAND (SLC) | Surface Mount | 8-WSON (8x6) | 7 ns | 2 Gbit | 8-WDFN Exposed Pad | ||
Winbond Electronics W25N02KVZEIU | SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 256M x 8 | 2.7 V | 3.6 V | Non-Volatile | FLASH | 104 MHz | FLASH - NAND (SLC) | Surface Mount | 8-WSON (8x6) | 7 ns | 2 Gbit | 8-WDFN Exposed Pad | ||
Winbond Electronics W25N02KWTBIU TR | SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 256M x 8 | 1.7 V | 1.95 V | Non-Volatile | FLASH | 104 MHz | FLASH - NAND (SLC) | Surface Mount | 24-TFBGA (8x6) | 8 ns | 2 Gbit | 24-TBGA | ||
Winbond Electronics W25N02KVTBIR | SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 256M x 8 | 2.7 V | 3.6 V | Non-Volatile | FLASH | 104 MHz | FLASH - NAND (SLC) | Surface Mount | 24-TFBGA (8x6) | 7 ns | 2 Gbit | 24-TBGA | ||
Winbond Electronics W25N02KVTCIR TR | SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 256M x 8 | 2.7 V | 3.6 V | Non-Volatile | FLASH | 104 MHz | FLASH - NAND (SLC) | Surface Mount | 24-TFBGA (8x6) | 7 ns | 2 Gbit | 24-TBGA | ||
Winbond Electronics W25N02KVZEIR | SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 256M x 8 | 2.7 V | 3.6 V | Non-Volatile | FLASH | 104 MHz | FLASH - NAND (SLC) | Surface Mount | 8-WSON (8x6) | 7 ns | 2 Gbit | 8-WDFN Exposed Pad | ||
Winbond Electronics W25N02JWZEIC | DTR, Quad I/O, SPI | 85 °C | -40 °C | 700 µs | 256M x 8 | 1.7 V | 1.95 V | Non-Volatile | FLASH | 166 MHz | FLASH - NAND (SLC) | Surface Mount | 8-WSON (8x6) | 8 ns | 2 Gbit | 8-WDFN Exposed Pad | ||
Winbond Electronics W25N02JWZEIF | DTR, Quad I/O, SPI | 85 °C | -40 °C | 700 µs | 256M x 8 | 1.7 V | 1.95 V | Non-Volatile | FLASH | 166 MHz | FLASH - NAND (SLC) | Surface Mount | 8-WSON (8x6) | 2 Gbit | 8-WDFN Exposed Pad | |||
Winbond Electronics W25N02KVTCIU | SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 256M x 8 | 2.7 V | 3.6 V | Non-Volatile | FLASH | 104 MHz | FLASH - NAND (SLC) | Surface Mount | 24-TFBGA (8x6) | 7 ns | 2 Gbit | 24-TBGA | ||
Winbond Electronics W25N02KVZEIU TR | SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 256M x 8 | 2.7 V | 3.6 V | Non-Volatile | FLASH | 104 MHz | FLASH - NAND (SLC) | Surface Mount | 8-WSON (8x6) | 7 ns | 2 Gbit | 8-WDFN Exposed Pad | ||
Winbond Electronics W25N02KVTBIR TR | SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 256M x 8 | 2.7 V | 3.6 V | Non-Volatile | FLASH | 104 MHz | FLASH - NAND (SLC) | Surface Mount | 24-TFBGA (8x6) | 7 ns | 2 Gbit | 24-TBGA | ||
Winbond Electronics W25N02KVTCIU TR | SPI - Quad I/O | 85 °C | -40 °C | 700 µs | 256M x 8 | 2.7 V | 3.6 V | Non-Volatile | FLASH | 104 MHz | FLASH - NAND (SLC) | Surface Mount | 24-TFBGA (8x6) | 7 ns | 2 Gbit | 24-TBGA |
Description
General part information
W25N02 Series
FLASH - NAND (SLC) Memory IC 2Gbit SPI - Quad I/O 104 MHz 7 ns 24-TFBGA (8x6)
Documents
Technical documentation and resources