Technical Specifications
Parameters and characteristics for this part
| Specification | STM32G473MCT3TR |
|---|---|
| Connectivity | I2C, SAI, SPI, CANbus, UART/USART, LINbus, QSPI, USB, IrDA |
| Core Processor | ARM® Cortex®-M4 |
| Core Size | 32-Bit |
| Data Converters [custom] | 12, 12 |
| Data Converters [custom] | 7, 41 |
| Mounting Type | Surface Mount |
| Number of I/O | 66 I/O |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -40 °C |
| Oscillator Type | External, Internal |
| Package / Case | 80-LQFP |
| Peripherals | POR, PWM, Brown-out Detect/Reset, I2S, TRNG, WDT, DMA |
| Program Memory Size | 256 KB |
| Program Memory Type | FLASH |
| RAM Size | 128 K |
| Voltage - Supply (Vcc/Vdd) [Max] | 3.6 V |
| Voltage - Supply (Vcc/Vdd) [Min] | 1.71 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tape & Reel (TR) | 1000 | $ 4.50 | |
Description
General part information
B-G473E-ZEST1S Series
The STM32G473xB/xC/xE devices are based on the high-performance Arm®Cortex®-M4 32-bit RISC core. They operate at a frequency of up to 170 MHz.
The Cortex-M4 core features a single-precision floating-point unit (FPU), which supports all the Arm single-precision data-processing instructions and all the data types. It also implements a full set of DSP (digital signal processing) instructions and a memory protection unit (MPU) which enhances the application’s security.
These devices embed high-speed memories (up to 512 Kbytes of flash memory, and 128 Kbytes of SRAM), a flexible external memory controller (FSMC) for static memories (for devices with packages of 100 pins and more), a Quad-SPI flash memory interface, and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses and a 32-bit multi-AHB bus matrix.
Documents
Technical documentation and resources