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TSX3704IYPT - 14-TSSOP

TSX3704IYPT

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STMicroelectronics

MICROPOWER COMPARATOR QUAD CMOS 2.7V TO 16V/±1.35V TO ±8V 14-PIN TSSOP T/R

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TSX3704IYPT - 14-TSSOP

TSX3704IYPT

Active
STMicroelectronics

MICROPOWER COMPARATOR QUAD CMOS 2.7V TO 16V/±1.35V TO ±8V 14-PIN TSSOP T/R

Deep-Dive with AI

Documents+10

Technical Specifications

Parameters and characteristics for this part

SpecificationTSX3704IYPT
CMRR, PSRR (Typ)90 dB, 90 dB
Current - Input Bias (Max) [Max]10 pA
Current - Output (Typ)20 mA
Current - Quiescent (Max) [Max]13 µA
Mounting TypeSurface Mount
Number of Elements4
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 °C
Output TypePush-Pull
Package / Case14-TSSOP
Package / Case [custom]0.173 "
Package / Case [custom]4.4 mm
Supplier Device Package14-TSSOP
TypeCMOS
Voltage - Input Offset (Max) [Max]5 mV
Voltage - Supply, Single/Dual (±) [Max]8 V, 16 V
Voltage - Supply, Single/Dual (±) [Min]-1.35 V, 2.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.93
10$ 1.73
25$ 1.64
100$ 1.39
250$ 1.31
500$ 1.14
1000$ 0.95
Digi-Reel® 1$ 1.93
10$ 1.73
25$ 1.64
100$ 1.39
250$ 1.31
500$ 1.14
1000$ 0.95
Tape & Reel (TR) 2500$ 0.81
NewarkEach (Supplied on Cut Tape) 1$ 1.51
10$ 1.02
25$ 0.98
50$ 0.94
100$ 0.91
250$ 0.85
500$ 0.82
1000$ 0.79

Description

General part information

TSX3704 Series

The TSX3704 is a micropower CMOS quad voltage comparator which exhibits a very low current consumption of 5 µA typical per comparator. This device was designed as the improvement of the TS3704: it shows a lower current consumption, a better input offset voltage, and an enhanced ESD tolerance. The TSX3704 is fully specified over a wide temperature range and is proposed in automotive grade for the TSSOP14 package. It is fully compatible with the TS3704 CMOS comparator and is available with similar packages. The new tiny package, QFN16 3x3, is also proposed for the TSX3704 thus allowing even more integration on applications.