
74AUP1G32GM-Q100X
ActiveNexperia USA Inc.
LOGIC GATES LOW-POWER 2-INPUT OR-GATE

74AUP1G32GM-Q100X
ActiveNexperia USA Inc.
LOGIC GATES LOW-POWER 2-INPUT OR-GATE
Description
General part information
74AUP1G32GM-Q100 Series
The 74AUP1G32-Q100 provides the single 2-input OR function.
Technical Specifications
Parameters and characteristics for this part
| Specification | 74AUP1G32GM-Q100X |
|---|---|
| Current - Output High | 4 mA |
| Current - Output Low | 4 mA |
| Current - Quiescent (Max) | 500 nA |
| Grade | Automotive |
| Input Logic Level - High (Max) | 2 V |
| Input Logic Level - High (Min) | 1.6 V |
| Input Logic Level - Low (Max) | 0.9 V |
| Input Logic Level - Low (Min) | 0.7 V |
| Logic Type | OR Gate |
| Max CL | 30 pF |
| Max Propagation Delay | 6.4 ns |
| Mounting Type | Surface Mount |
| Number of Circuits | 1 |
| Number of Inputs | 2 |
| Operating Temperature (Max) | 125 °C |
| Operating Temperature (Min) | -40 °C |
| Package / Case | 6-XFDFN |
| Package Length | 1.45 mm |
| Package Name | 6-XSON, SOT886 |
| Package Width | 1 mm |
| Qualification | AEC-Q100 |
| Voltage - Supply (Maximum) | 3.6 V |
| Voltage - Supply (Minimum) | 0.8 V |
Pricing
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CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
74AUP1G32GM-Q100 Nexperia Product Reliability
Automotive logic in MicroPak leadless packages
Nexperia package poster
MAR_SOT886 Topmark
MicroPak leadless logic portfolio guide
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904
plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body
plastic, extremely thin small outline package; no leads; 6 terminals; 0.6 mm pitch; 1 mm x 1.45 mm x 0.5 mm body
Reflow soldering profile
XSON6; Reel pack for SMD, 7''; Q1/T1 product orientation
plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body