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TN2124K1-G - SOT-23 / 3

TN2124K1-G

Active
Microchip Technology

MOSFET, N-CH, 240V, 0.134A, SOT-23 ROHS COMPLIANT: YES

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TN2124K1-G - SOT-23 / 3

TN2124K1-G

Active
Microchip Technology

MOSFET, N-CH, 240V, 0.134A, SOT-23 ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics commom to parts in this series

SpecificationTN2124K1-GTN2124 Series
Current - Continuous Drain (Id) @ 25°C-134 mA
Drain to Source Voltage (Vdss)-240 V
Drive Voltage (Max Rds On, Min Rds On)-3 - 4.5 V
FET Type-N-Channel
Input Capacitance (Ciss) (Max) @ Vds-50 pF
Mounting Type-Surface Mount
null-
Operating Temperature--55 °C
Operating Temperature-150 °C
Package / Case-SOT-23-3, TO-236-3, SC-59
Power Dissipation (Max)-360 mW
Rds On (Max) @ Id, Vgs-15 Ohm
Supplier Device Package-TO-236AB (SOT23)
Technology-MOSFET (Metal Oxide)
Vgs (Max)-20 V
Vgs(th) (Max) @ Id-2 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.86
25$ 0.72
100$ 0.64
Digi-Reel® 1$ 0.86
25$ 0.72
100$ 0.64
Tape & Reel (TR) 3000$ 0.64
Microchip DirectT/R 1$ 0.86
25$ 0.72
100$ 0.64
1000$ 0.54
5000$ 0.50
10000$ 0.46
NewarkEach (Supplied on Full Reel) 1$ 0.67

TN2124 Series

MOSFET, N-Channel Enhancement-Mode, 240V, 15 Ohm

PartOperating Temperature [Min]Operating Temperature [Max]Vgs (Max)TechnologyPackage / CaseCurrent - Continuous Drain (Id) @ 25°CMounting TypeDrive Voltage (Max Rds On, Min Rds On)Supplier Device PackageDrain to Source Voltage (Vdss)Rds On (Max) @ Id, VgsVgs(th) (Max) @ IdPower Dissipation (Max)Input Capacitance (Ciss) (Max) @ VdsFET Type
Microchip Technology
TN2124K1-G
Microchip Technology
TN2124K1-G
Microchip Technology
TN2124K1-G
-55 °C
150 °C
20 V
MOSFET (Metal Oxide)
SC-59, SOT-23-3, TO-236-3
134 mA
Surface Mount
3 V, 4.5 V
TO-236AB (SOT23)
240 V
15 Ohm
2 V
360 mW
50 pF
N-Channel

Description

General part information

TN2124 Series

This low threshold, enhancement-mode (normally-off) transistor utilizes a vertical DMOS structure and well-proven, silicon-gate manufacturing process. This combination produces a device with the power handling capabilities of bipolar transistors and the high input impedance and positive temperature coefficient inherent in MOS devices. Characteristic of all MOS structures, this device is free from thermal runaway and thermally-induced secondary breakdown.

Vertical DMOS FETs are ideally suited to a wide range of switching and amplifying applications where very low threshold voltage, high breakdown voltage, high input impedance, low input capacitance, and fast switching speeds are desired.