Specification	RP605Z363B-E2-F

Applications	Battery Management, Power Supplies
Current - Supply	300 nA
Mounting Type	Surface Mount
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	-40 °C
Package / Case	WLCSP, 20-XFBGA
Package Length	2.32 mm
Package Name	20-WLCSP-P3
Package Width	1.71 mm
Voltage - Supply (Maximum)	5.5 V
Voltage - Supply (Minimum)	1.8 V

RP605 Series

Part	Mounting Type	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)	Package / Case	Operating Temperature (Max)	Operating Temperature (Min)	Applications	Current - Supply	Package Name	Package Width	Package Length	Current - Output	Topology	Synchronous Rectifier	Voltage - Input (Min)	Number of Outputs	Voltage - Input (Max)	Function	Output Type	Voltage - Output (Min/Fixed)	Output Configuration	Supplied Contents	Board Type	Total Output Count	Non-Isolated Output Count	Contents	Regulator Topology	Utilized IC / Part	Main Purpose	Voltage - Output	Voltage - Input (Maximum)	Voltage - Input (Minimum)
Nisshinbo Micro Devices Inc. RP605Z363B-E2-F	Surface Mount	5.5 V	1.8 V	20-XFBGA WLCSP	85 °C	-40 °C	Battery Management Power Supplies	300 nA	20-WLCSP-P3	1.71 mm	2.32 mm
Nisshinbo Micro Devices Inc. RP605K333B-TR	Surface Mount			12-UFDFN Exposed Pad	125 °C	-40 °C			DFN(PL)2730-12			300 mA	Buck-Boost	No	1.8 V	1	5.5 V	Step-Down Step-Up	Fixed	3.3 V	Positive
Nisshinbo Micro Devices Inc. RP605Z333B-EV												300 mA							Non-Isolated			Board(s)	Fully Populated	1	1 count	Board	Buck-Boost	RP605	DC/DC Step Up or Down	3.3 V	5.5 V	1.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Create a free account to access distributor pricing data.

3D models and CAD resources for this part

Technical documentation and resources