Specification	14-354000-21-RC

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	10 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Brass
Convert From (Adapter End)	DIP
Convert From (Adapter End) Row Spacing	0.3 "
Convert From (Adapter End) Type	Row Spacing, DIP
Convert To (Adapter End)	SOIC
Current Rating	3 A
Housing Material	Nylon 4/6, Glass Filled, PA46, Polyamide
Material Flammability Rating	UL94 V-0
Mounting Type	Surface Mount
Number of Pins	14 pins
Pitch - Mating	0.1 in
Pitch - Post	0.05 in
Termination	Solder
Termination Post Length	0.089 in

14-3540 Series

Part	Termination Post Length	Contact Material - Post	Material Flammability Rating	Current Rating	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Number of Pins	Housing Material	Pitch - Post	Termination	Contact Finish - Post	Contact Finish - Mating	Pitch - Mating	Convert From (Adapter End) Row Spacing	Convert From (Adapter End)	Convert From (Adapter End) Type	Mounting Type	Convert To (Adapter End)
Aries Electronics 14-354000-21-RC	0.089 in	Brass	UL94 V-0	3 A	Beryllium Copper	10 µin	10 µin	14 pins	Glass Filled Nylon 4/6 PA46 Polyamide	0.05 in	Solder	Gold	Gold	0.1 in	0.3 "	DIP	DIP Row Spacing	Surface Mount	SOIC
Aries Electronics 14-354000-20		Brass	UL94 V-0	3 A	Beryllium Copper	10 µin	10 µin	14 pins	Glass Filled Nylon 4/6 PA46 Polyamide	0.05 in	Solder	Gold	Gold	0.1 in	0.3 "	DIP	DIP Row Spacing	Surface Mount	SOIC
Aries Electronics 14-354000-11-RC	0.03 in	Brass	UL94 V-0	3 A	Beryllium Copper	10 µin	10 µin	14 pins	Glass Filled Nylon 4/6 PA46 Polyamide	0.05 in	Solder	Gold	Gold	0.1 in	0.3 "	DIP	DIP Row Spacing	Surface Mount	SOIC
Aries Electronics 14-354000-10		Brass	UL94 V-0	3 A	Beryllium Copper	10 µin	10 µin	14 pins	Glass Filled Nylon 4/6 PA46 Polyamide	0.05 in	Solder	Gold	Gold	0.1 in	0.3 "	DIP	DIP Row Spacing	Surface Mount	SOIC

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