Specification	WB35SD160ALZ

Current - Average Rectified (Io)	35 A
Current - Reverse Leakage	50 µA
Mounting Type	Surface Mount
Operating Temperature - Junction	150 °C
Package / Case	Die
Package Name	Wafer
Speed	Standard Recovery
Speed - Fast Recovery (Minimum)	200 mA, 500 ns
Speed - Recovery Current	200 mA, 200 mA
Speed - Recovery Time	500 ns
Technology	Standard
Voltage - DC Reverse (Vr) (Max)	1600 V
Voltage - Forward (Vf) (Max)	1.2 V

WB35 Series

Part	Current - Reverse Leakage	Package / Case	Technology	Voltage - DC Reverse (Vr) (Max)	Speed - Fast Recovery (Minimum)	Speed	Speed - Recovery Current	Speed - Recovery Time	Mounting Type	Package Name	Operating Temperature - Junction	Voltage - Forward (Vf) (Max)	Current - Average Rectified (Io)
WeEn Semiconductors WB35SD160ALZ	50 µA	Die	Standard	1600 V	200 mA 500 ns	Standard Recovery	200 mA 200 mA	500 ns	Surface Mount	Wafer	150 °C	1.2 V	35 A

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Create a free account to access distributor pricing data.

3D models and CAD resources for this part

Technical documentation and resources

No documents available