Specification	YTE-135-02-G-6-375

Connector Type	Elevated Socket
Contact Finish - Mating	Gold
Contact Finish - Post	Tin
Contact Finish Thickness - Mating	20 Ąin
Contact Type	Forked
Fastening Type	Push-Pull
Insulation Color	Black
Insulation Height	0.375 in
Mounting Type	Through Hole
Number of Positions	210
Number of Positions Loaded	All
Number of Rows	6
Operating Temperature (Max)	105 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.079 in
Row Spacing - Mating	0.079 in
Style	Board
Termination	Solder

YTE Series

Board to Board & Mezzanine Connectors "2.00 mm FleXYZ High-Density Elevated Socket Strip\/

Part	Insulation Height	Row Spacing - Mating	Connector Type	Termination	Contact Finish - Mating	Insulation Color	Contact Finish Thickness - Mating	Number of Positions	Mounting Type	Pitch - Mating	Number of Positions Loaded	Operating Temperature (Min)	Operating Temperature (Max)	Contact Type	Style	Number of Rows	Fastening Type	Contact Finish - Post	Contact Finish Thickness - Post	Insulation Material	Contact Material	Contact Shape
Samtec Inc. YTE-112-02-G-6-590	0.59 in	0.079 in	Elevated Socket	Solder	Gold	Black	20 Ąin	72	Through Hole	0.079 in	All	-55 °C	105 °C	Forked	Board	6	Push-Pull	Tin
Samtec Inc. YTE-130-02-G-Q-570	0.57 in	0.079 in	Elevated Socket	Solder	Gold	Black	20 Ąin	120	Through Hole	0.079 in	All	-55 °C	105 °C	Forked	Board	4	Push-Pull	Tin	50 µin	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Square
Samtec Inc. YTE-125-02-G-6-750	0.75 in	0.079 in	Elevated Socket	Solder	Gold	Black	20 Ąin	150	Through Hole	0.079 in	All	-55 °C	105 °C	Forked	Board	6	Push-Pull	Tin	50 µin	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Square
Samtec Inc. YTE-106-02-M-Q-735	0.735 in	0.079 in	Elevated Socket	Solder	Gold	Black	20 Ąin	24 pos	Through Hole	0.079 in	All	-55 °C	105 °C	Forked	Board	4	Push-Pull	Tin		Liquid Crystal Polymer (LCP)	Phosphor Bronze	Square
Samtec Inc. YTE-135-02-L-6-669	0.669 in	0.079 in	Elevated Socket	Solder	Gold	Black	10 µin	210	Through Hole	0.079 in	All	-55 °C	105 °C	Forked	Board	6	Push-Pull	Tin
Samtec Inc. YTE-120-03-L-Q-374	0.374 in	0.079 in	Elevated Socket	Solder	Gold	Black	10 µin	80	Through Hole	0.079 in	All	-55 °C	105 °C	Forked	Board	4	Push-Pull	Tin
Samtec Inc. YTE-125-02-L-5-715	0.715 in	0.079 in	Elevated Socket	Solder	Gold	Black	10 µin	125	Through Hole	0.079 in	All	-55 °C	105 °C	Forked	Board	5	Push-Pull	Tin	50 µin	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Square
Samtec Inc. YTE-130-02-F-Q-500	0.5 in	0.079 in	Elevated Socket	Solder	Gold	Black	3 µin	120	Through Hole	0.079 in	All	-55 °C	105 °C	Forked	Board	4	Push-Pull	Tin	50 µin	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Square
Samtec Inc. YTE-146-03-G-Q-340	0.34 in	0.079 in	Elevated Socket	Solder	Gold	Black	20 Ąin	184	Through Hole	0.079 in	All	-55 °C	105 °C	Forked	Board	4	Push-Pull	Tin
Samtec Inc. YTE-104-02-G-Q-750	0.75 in	0.079 in	Elevated Socket	Solder	Gold	Black	20 Ąin	16	Through Hole	0.079 in	All	-55 °C	105 °C	Forked	Board	4	Push-Pull	Tin	50 µin	Liquid Crystal Polymer (LCP)	Phosphor Bronze	Square

Pricing

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YTE-135-02-G-6-375 | Datasheet