YTE Series
Board to Board & Mezzanine Connectors "2.00 mm FleXYZ High-Density Elevated Socket Strip\/
Manufacturer: Samtec Inc.
Catalog
Board to Board & Mezzanine Connectors "2.00 mm FleXYZ High-Density Elevated Socket Strip\/
Board to Board & Mezzanine Connectors "2.00 mm FleXYZ High-Density Elevated Socket Strip\/
| Part | Insulation Height | Row Spacing - Mating | Connector Type | Termination | Contact Finish - Mating | Insulation Color | Contact Finish Thickness - Mating | Number of Positions | Mounting Type | Pitch - Mating | Number of Positions Loaded | Operating Temperature (Min) | Operating Temperature (Max) | Contact Type | Style | Number of Rows | Fastening Type | Contact Finish - Post | Contact Finish Thickness - Post | Insulation Material | Contact Material | Contact Shape |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.59 in | 0.079 in | Elevated Socket | Solder | Gold | Black | 20 Ąin | 72 | Through Hole | 0.079 in | All | -55 °C | 105 °C | Forked | Board | 6 | Push-Pull | Tin | ||||
Samtec Inc. | 0.57 in | 0.079 in | Elevated Socket | Solder | Gold | Black | 20 Ąin | 120 | Through Hole | 0.079 in | All | -55 °C | 105 °C | Forked | Board | 4 | Push-Pull | Tin | 50 µin | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Square |
Samtec Inc. | 0.75 in | 0.079 in | Elevated Socket | Solder | Gold | Black | 20 Ąin | 150 | Through Hole | 0.079 in | All | -55 °C | 105 °C | Forked | Board | 6 | Push-Pull | Tin | 50 µin | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Square |
Samtec Inc. | 0.735 in | 0.079 in | Elevated Socket | Solder | Gold | Black | 20 Ąin | 24 pos | Through Hole | 0.079 in | All | -55 °C | 105 °C | Forked | Board | 4 | Push-Pull | Tin | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Square | |
Samtec Inc. | 0.669 in | 0.079 in | Elevated Socket | Solder | Gold | Black | 10 µin | 210 | Through Hole | 0.079 in | All | -55 °C | 105 °C | Forked | Board | 6 | Push-Pull | Tin | ||||
Samtec Inc. | 0.374 in | 0.079 in | Elevated Socket | Solder | Gold | Black | 10 µin | 80 | Through Hole | 0.079 in | All | -55 °C | 105 °C | Forked | Board | 4 | Push-Pull | Tin | ||||
Samtec Inc. | 0.715 in | 0.079 in | Elevated Socket | Solder | Gold | Black | 10 µin | 125 | Through Hole | 0.079 in | All | -55 °C | 105 °C | Forked | Board | 5 | Push-Pull | Tin | 50 µin | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Square |
Samtec Inc. | 0.5 in | 0.079 in | Elevated Socket | Solder | Gold | Black | 3 µin | 120 | Through Hole | 0.079 in | All | -55 °C | 105 °C | Forked | Board | 4 | Push-Pull | Tin | 50 µin | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Square |
Samtec Inc. | 0.34 in | 0.079 in | Elevated Socket | Solder | Gold | Black | 20 Ąin | 184 | Through Hole | 0.079 in | All | -55 °C | 105 °C | Forked | Board | 4 | Push-Pull | Tin | ||||
Samtec Inc. | 0.75 in | 0.079 in | Elevated Socket | Solder | Gold | Black | 20 Ąin | 16 | Through Hole | 0.079 in | All | -55 °C | 105 °C | Forked | Board | 4 | Push-Pull | Tin | 50 µin | Liquid Crystal Polymer (LCP) | Phosphor Bronze | Square |