Specification	239-5605-01-0602

Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 µin
Contact Finish Thickness - Post	30 µin
Contact Material - Mating	Beryllium Copper
Contact Material - Post	Beryllium Copper
Contact Resistance	25 mOhm
Current Rating	1 A
Features	Closed Frame
Grid Layout Options	1 x 20, 1 x 19
Housing Material	Polysulfone, PSU, Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Positions or Pins (Grid)	39
Operating Temperature (Max)	150 °C
Operating Temperature (Min)	-55 °C
Pitch - Mating	0.1 in
Pitch - Post	0.1 in
Termination	Solder
Termination Post Length	0.1 in
Type	Zig-Zag

239 Series

Part	Contact Finish Thickness - Mating	Contact Finish - Post	Housing Material	Termination	Contact Finish Thickness - Post	Mounting Type	Pitch - Post	Contact Material - Post	Contact Material - Mating	Features	Grid Layout Options	Number of Positions or Pins (Grid)	Type	Pitch - Mating	Contact Finish - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Contact Resistance	Material Flammability Rating	Current Rating	Termination Post Length
3M Electronic Specialty 239-5605-01-0602	30 µin	Gold	Glass Filled Polysulfone PSU	Solder	30 µin	Through Hole	0.1 in	Beryllium Copper	Beryllium Copper	Closed Frame	1 x 19 1 x 20	39	Zig-Zag	0.1 in	Gold	150 °C	-55 °C	25 mOhm	UL94 V-0	1 A	0.1 in

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