BDN16-3CB/A01

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Tusonix a Subsidiary of CTS Electronic Components

HEATSINK CPU W/ADHESIVE 1.61"SQ

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Tusonix a Subsidiary of CTS Electronic Components

HEATSINK CPU W/ADHESIVE 1.61"SQ

Technical Specifications

Parameters and characteristics for this part

Specification	BDN16-3CB/A01

Attachment Method	Thermal Tape, Adhesive (Included)
Fin Height	9.02 mm
Fin Height	0.355 in
Length	1.61 in
Length	40.89 mm
Material	Aluminum
Material Finish	Black Anodized
Package Cooled	ASIC, BGA, LGA, CPU
Shape	Square, Pin Fins
Shelf Life	24 Months
Thermal Resistance @ Forced Air Flow	400 LFM, 4.5 °C/W
Thermal Resistance @ Natural	13.5 °C/W
Type	Top Mount
Width [x]	1.61 in
Width [x]	40.89 mm

Part	Thermal Resistance @ Forced Air Flow	Width [x]	Width [x]	Material Finish	Thermal Resistance @ Natural	Shape	Material	Type	Shelf Life	Length	Length	Attachment Method	Package Cooled	Fin Height	Fin Height
Tusonix a Subsidiary of CTS Electronic Components BDN16-3CB/A01	4.5 °C/W 400 LFM	1.61 in	40.89 mm	Black Anodized	13.5 °C/W	Pin Fins Square	Aluminum	Top Mount	24 Months	1.61 in	40.89 mm	Thermal Tape Adhesive (Included)	ASIC BGA CPU LGA	9.02 mm	0.355 in

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	2000	$ 3.92

General part information

Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount

Technical documentation and resources