Specification	HSM825GE3/TR13

Current - Average Rectified (Io)	8 A
Current - Reverse Leakage	250 µA
Mounting Type	Surface Mount
Operating Temperature - Junction (Max)	175 °C
Operating Temperature - Junction (Min)	-55 °C
Package / Case	DO-215AB, SMC Gull Wing
Package Name	DO-215AB
Speed - Fast Recovery (Maximum)	500 ns
Speed - Fast Recovery (Minimum)	200 mA
Technology	Schottky
Voltage - DC Reverse (Vr) (Max)	25 V
Voltage - Forward (Vf) (Max)	620 mV

HSM825 Series

Part	Mounting Type	Operating Temperature - Junction (Max)	Operating Temperature - Junction (Min)	Package Name	Voltage - Forward (Vf) (Max)	Voltage - DC Reverse (Vr) (Max)	Speed - Fast Recovery (Maximum)	Speed - Fast Recovery (Minimum)	Current - Reverse Leakage	Current - Average Rectified (Io)	Package / Case	Technology
Microchip Technology HSM825GE3/TR13	Surface Mount	175 °C	-55 °C	DO-215AB	620 mV	25 V	500 ns	200 mA	250 µA	8 A	DO-215AB SMC Gull Wing	Schottky
Microchip Technology HSM825J/TR13	Surface Mount	175 °C	-55 °C	DO-214AB	620 mV	25 V	500 ns	200 mA	250 µA	8 A	DO-214AB SMC	Schottky
Microchip Technology HSM825G/TR13	Surface Mount	175 °C	-55 °C	DO-215AB	620 mV	25 V	500 ns	200 mA	250 µA	8 A	DO-215AB SMC Gull Wing	Schottky
Microchip Technology HSM825JE3/TR13	Surface Mount	175 °C	-55 °C	DO-214AB	620 mV	25 V	500 ns	200 mA	250 µA	8 A	DO-214AB SMC	Schottky

Pricing

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