HTSW-133-08-T-S

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Samtec Inc.

CONN HEADER VERT 33POS 2.54MM

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HTSW-133-08-T-S

Active

Samtec Inc.

CONN HEADER VERT 33POS 2.54MM

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Specifications Pricing Series Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	HTSW-133-08-T-S

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HTSW-133 Series

Part	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material	Insulation Height	Insulation Height	Mounting Type	Contact Length - Post	Contact Length - Post	Operating Temperature [Min]	Operating Temperature [Max]	Shrouding	Fastening Type	Current Rating (Amps)	Number of Rows	Overall Contact Length	Overall Contact Length	Contact Finish - Mating	Termination	Connector Type	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Insulation Color	Number of Positions Loaded	Contact Length - Mating [x]	Contact Length - Mating	Contact Type	Style	Material Flammability Rating	Contact Finish - Post	Contact Shape	Pitch - Mating	Pitch - Mating	Insulation Material	Number of Positions	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Length - Mating	Contact Length - Post [x]
Samtec Inc. HTSW-133-07-F-D	3 µin	0.076 µm	Phosphor Bronze	0.1 in	2.54 mm	Through Hole	2.54 mm	0.1 in	-55 °C	125 °C	Unshrouded	Push-Pull	Varies by Wire Gauge	2	0.43 in	10.92 mm	Gold	Solder	Header	2.54 mm	0.1 in	Natural	All	0.23 in	5.84 mm	Male Pin	Board to Board Cable	UL94 V-0	Tin	Square	0.1 in	2.54 mm	Liquid Crystal Polymer (LCP)	66
Samtec Inc. HTSW-133-08-T-S
Samtec Inc. HTSW-133-07-H-S	30 Áin	0.76 Ám	Phosphor Bronze	0.1 in	2.54 mm	Through Hole	2.54 mm	0.1 in	-55 °C	125 °C	Unshrouded	Push-Pull	Varies by Wire Gauge	1	0.43 in	10.92 mm	Gold	Solder	Header			Natural	All	0.23 in	5.84 mm	Male Pin	Board to Board Cable	UL94 V-0	Gold	Square	0.1 in	2.54 mm	Liquid Crystal Polymer (LCP)	33	3 µin	0.076 µm
Samtec Inc. HTSW-133-14-G-S	10 çin	0.25 çm	Phosphor Bronze	0.1 in	2.54 mm	Through Hole	2.79 mm		-55 °C	125 °C	Unshrouded	Push-Pull	Varies by Wire Gauge	1	0.53 in	13.46 mm	Gold	Solder	Header			Natural	All		8.13 mm	Male Pin	Board to Board Cable	UL94 V-0	Gold	Square	0.1 in	2.54 mm	Liquid Crystal Polymer (LCP)	33	3 µin	0.076 µm	0.32 in	0.11 in
Samtec Inc. HTSW-133-07-G-D	10 çin	0.25 çm	Phosphor Bronze	0.1 in	2.54 mm	Through Hole	2.54 mm	0.1 in	-55 °C	125 °C	Unshrouded	Push-Pull	Varies by Wire Gauge	2	0.43 in	10.92 mm	Gold	Solder	Header	2.54 mm	0.1 in	Natural	All	0.23 in	5.84 mm	Male Pin	Board to Board Cable	UL94 V-0	Gold	Square	0.1 in	2.54 mm	Liquid Crystal Polymer (LCP)	66	3 µin	0.076 µm
Samtec Inc. HTSW-133-08-S-D-RA	30 Áin	0.76 Ám	Phosphor Bronze	0.24 in	6.1 mm	Through Hole Right Angle	2.29 mm	0.09 "	-55 °C	125 °C	Unshrouded	Push-Pull	Varies by Wire Gauge	2			Gold	Solder	Header	2.54 mm	0.1 in	Natural	All	0.23 in	5.84 mm	Male Pin	Board to Board Cable	UL94 V-0	Tin	Square	0.1 in	2.54 mm	Liquid Crystal Polymer (LCP)	66
Samtec Inc. HTSW-133-14-T-S			Phosphor Bronze	0.1 in	2.54 mm	Through Hole	2.79 mm		-55 °C	105 ░C	Unshrouded	Push-Pull	Varies by Wire Gauge	1	0.53 in	13.46 mm		Solder	Header			Natural	All		8.13 mm	Male Pin	Board to Board Cable	UL94 V-0	Tin	Square	0.1 in	2.54 mm	Liquid Crystal Polymer (LCP)	33			0.32 in	0.11 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	1	$ 2.60

Description

General part information

HTSW-133 Series

Connector Header position

Documents

Technical documentation and resources