UDZVTE-173.3B
ActiveRohm Semiconductor
200MW 3.3V, SOD-323FL, ZENER DIODE
UDZVTE-173.3B
ActiveRohm Semiconductor
200MW 3.3V, SOD-323FL, ZENER DIODE
Description
General part information
UDZVTE Series
ROHM's zener diodes are available in various lineup as 2-pin mold surface mount type and complex type.
Technical Specifications
Parameters and characteristics for this part
| Specification | UDZVTE-173.3B |
|---|---|
| Mounting Type | Surface Mount |
| Operating Temperature (Max) | 150 °C |
| Operating Temperature (Min) | -55 °C |
| Package / Case | SOD-323F, SC-90 |
| Package Name | UMD2 |
| Power - Max | 200 mW |
| Voltage - Zener (Nom) (Vz) | 3.3 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
Technical Data Sheet EN
UMD2M TE17 Taping Spec
UMD2 Part Marking
Diode Flammability
Notes for Calculating Power Consumption:Static Operation
Basics of Thermal Resistance and Heat Dissipation
Anti-Whisker formation - Diodes
Inner Structure
List of Diode Package Thermal Resistance
Two-Resistor Model for Thermal Simulation
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Power Loss and Thermal Design of Diodes
Part Explanation
Impedance Characteristics of Bypass Capacitor
Method for Monitoring Switching Waveform
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Compliance of the RoHS directive
Moisture Sensitivity Level - Diodes
Low-Side Current Sensing Circuit Design
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Absolute Maximum Rating and Electrical Characteristics of Diodes
Small-Signal Discrete Devices Zener Diodes(Long-Selling Products) - EDZV, UDZV
Differences between TVS and Zener Diodes
What is a Thermal Model? (Diode)
About Export Regulations
PCB Layout Thermal Design Guide
What Is Thermal Design
ESD Data
Condition of Soldering / Land Pattern Reference
Measurement Method and Usage of Thermal Resistance RthJC
Precautions When Measuring the Rear of the Package with a Thermocouple
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Notes for Temperature Measurement Using Forward Voltage of PN Junction
What Are TVS Diodes?
Certificate of not containing SVHC under REACH Regulation
PCB Layout for TVS Diodes
Judgment Criteria of Thermal Evaluation
Diode Types and Applications
How to Select Reverse Current Protection Diodes for LDO Regulators
Selection Method and Usage of TVS Diodes
UDZV3.3B Data Sheet
Reliability Test Result
Importance of Probe Calibration When Measuring Power: Deskew
How to Use LTspice® Models: Tips for Improving Convergence
How to Create Symbols for PSpice Models
How to Use LTspice® Models
Notes for Temperature Measurement Using Thermocouples
Package Dimensions
