Specification	96-7069-9520

Ag Composition	3 %
Composition Elements	Cu, Sn, Ag
Composition Formula	Sn96.5Ag3Cu0.5
Cu Composition	0.5 %
Diameter	0.02 in
Form	Spool
Form Weight	17.64 oz
Melting Point (Max)	424 °F
Melting Point (Min)	423 °F
Process	Lead Free
Shelf Life	36 Months
Shelf Life Start	Date of Manufacture
Sn Composition	96.5 %
Storage/Refrigeration Temperature (Maximum)	104 °F
Storage/Refrigeration Temperature (Minimum)	50 °F
Type	Wire Solder
Wire Gauge	25 SWG, 24 AWG

96-7069 Series

Part	Process	Melting Point (Max)	Melting Point (Min)	Ag Composition	Composition Elements	Composition Formula	Cu Composition	Sn Composition	Form Weight	Form	Shelf Life	Wire Gauge	Storage/Refrigeration Temperature (Minimum)	Storage/Refrigeration Temperature (Maximum)	Diameter	Type	Shelf Life Start
Kester Solder 96-7069-9520	Lead Free	424 °F	423 °F	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	17.64 oz	Spool	36 Months	24 AWG 25 SWG	50 °F	104 °F	0.02 in	Wire Solder	Date of Manufacture
Kester Solder 96-7069-9515	Lead Free	424 °F	423 °F	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	17.64 oz	Spool	36 Months	27 AWG 28 SWG	50 °F	104 °F	0.015 in	Wire Solder	Date of Manufacture
Kester Solder 96-7069-9525	Lead Free	424 °F	423 °F	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	17.64 oz	Spool	36 Months	22 AWG 23 SWG	50 °F	104 °F	0.025 in	Wire Solder	Date of Manufacture
Kester Solder 96-7069-9531	Lead Free	424 °F	423 °F	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	17.64 oz	Spool	36 Months	20 AWG 22 SWG	50 °F	104 °F	0.031 in	Wire Solder	Date of Manufacture
Kester Solder 96-7069-9540	Lead Free	424 °F	423 °F	3 %	Ag Cu Sn	Sn96.5Ag3Cu0.5	0.5 %	96.5 %	17.64 oz	Spool	36 Months	18 AWG 19 SWG	50 °F	104 °F	0.04 in	Wire Solder	Date of Manufacture

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