RFN16T2DNZC9
ActiveRohm Semiconductor
DIODE ARRAY GP 200V 16A TO-220FN
RFN16T2DNZC9
ActiveRohm Semiconductor
DIODE ARRAY GP 200V 16A TO-220FN
Description
General part information
RFN16T2DNZ Series
RFN16T2DNZ is Low VFfast recovery Diode for General rectification.
Technical Specifications
Parameters and characteristics for this part
| Specification | RFN16T2DNZC9 |
|---|---|
| Current - Average Rectified (Io) (per Diode) | 16 A |
| Current - Reverse Leakage | 10 µA |
| Diode Configuration | Common Cathode |
| Diode Pair Count | 1 pair |
| Mounting Type | Through Hole |
| Operating Temperature - Junction | 150 °C |
| Package / Case | TO-220-3 Full Pack |
| Package Name | TO-220FN |
| Reverse Recovery Time (trr) | 30 ns |
| Speed - Fast Recovery (Maximum) | 500 ns |
| Speed - Fast Recovery (Minimum) | 200 mA |
| Technology | Standard |
| Voltage - DC Reverse (Vr) (Max) | 200 V |
| Voltage - Forward (Vf) (Max) | 980 mV |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Sign in to see pricing
Create a free account to access distributor pricing data.
CAD
3D models and CAD resources for this part
Documents
Technical documentation and resources
Datasheet
θ<sub>JC</sub> and Ψ<sub>JT</sub>
Package Dimensions
How to Use the Thermal Resistance and Thermal Characteristics Parameters
Absolute Maximum Rating and Electrical Characteristics of Diodes
Judgment Criteria of Thermal Evaluation
PCB Layout Thermal Design Guide
About Export Regulations
Power Loss and Thermal Design of Diodes
Explanation for Marking
Moisture Sensitivity Level - Diodes
Anti-Whisker formation - Diodes
Reliability Test Result
RFN16T2DNZ ESD Data
Taping Information
Condition of Soldering / Land Pattern Reference
Method for Monitoring Switching Waveform
About Flammability of Materials
How to Use LTspice® Models
Certificate of not containing SVHC under REACH Regulation
How to Select Rectifier Diodes
List of Diode Package Thermal Resistance
Diode Types and Applications
Importance of Probe Calibration When Measuring Power: Deskew
Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials
How to Select Reverse Current Protection Diodes for LDO Regulators
Compliance of the RoHS directive
Impedance Characteristics of Bypass Capacitor
Method for Calculating Junction Temperature from Transient Thermal Resistance Data
What is a Thermal Model? (Diode)
Precautions When Measuring the Rear of the Package with a Thermocouple
θ<sub>JA</sub> and Ψ<sub>JT</sub>
Notes for Temperature Measurement Using Thermocouples
Two-Resistor Model for Thermal Simulation
Inner Structure
Basics of Thermal Resistance and Heat Dissipation
Notes for Temperature Measurement Using Forward Voltage of PN Junction
Part Explanation
Measurement Method and Usage of Thermal Resistance RthJC
Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)
Notes for Calculating Power Consumption:Static Operation
What Is Thermal Design
How to Use LTspice® Models: Tips for Improving Convergence