BGM210P032JIA2

Unknown

SILICON LABS

RF TXRX MOD BLUETOOTH CHIP SMD

BGM210P032JIA2

Unknown

SILICON LABS

RF TXRX MOD BLUETOOTH CHIP SMD

Description Specifications Series Pricing CAD Documents

Description

General part information

BGM210 Series

Bluetooth Bluetooth v5.1 Transceiver Module 2.4GHz ~ 2.4835GHz Integrated, Chip Surface Mount

Technical Specifications

Parameters and characteristics for this part

Specification	BGM210P032JIA2

Antenna Type	Chip, Integrated
Current - Receiving (Max)	9.9 mA
Current - Receiving (Min)	9.1 mA
Current - Transmitting (Max)	173 mA
Current - Transmitting (Min)	59.7 mA
Data Rate	2 Mbps
Frequency (Max)	2.4835 GHz
Frequency (Min)	2.4 GHz
Memory Size (Flash)	1 MB
Memory Size (RAM)	96 kB
Memory Size (SRAM)	96 kB
Memory Type	RAM, Flash, SRAM
Modulation	GFSK
Mounting Type	Surface Mount
Operating Temperature (Max)	125 °C
Operating Temperature (Min)	-40 °C
Package / Case	31-SMD Module
Power - Output	20 dBm
Protocol	Bluetooth v5.1
RF Family/Standard	Bluetooth
Sensitivity	-104.5 dBm
Serial Interfaces	ADC, I2S, I2C, IrDA, SPI, UART, PWM, GPIO
Utilized IC / Part	EFR32BG21
Voltage - Supply (Maximum)	3.8 V
Voltage - Supply (Minimum)	1.71 V

BGM210 Series

Part	Frequency (Max)	Frequency (Min)	RF Family/Standard	Operating Temperature (Max)	Operating Temperature (Min)	Mounting Type	Modulation	Data Rate	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)	Serial Interfaces	Antenna Type	Package / Case	Utilized IC / Part	Current - Transmitting (Max)	Current - Transmitting (Min)	Protocol	Power - Output	Current - Receiving (Min)	Current - Receiving (Max)	Memory Size (SRAM)	Memory Type	Memory Size (RAM)	Memory Size (Flash)	Sensitivity
SILICON LABS BGM210PA32JIA2	2.4835 GHz	2.4 GHz	Bluetooth	125 °C	-40 °C	Surface Mount	GFSK	2 Mbps	3.8 V	1.71 V	ADC GPIO I2C I2S IrDA PWM SPI UART	Chip Integrated	31-SMD Module	EFR32BG21	173 mA	59.7 mA	Bluetooth v5.3	20 dBm	9.1 mA	9.9 mA	96 kB	Flash RAM SRAM	96 kB	1 MB	-104.5 dBm
SILICON LABS BGM210PA22JIA2	2.4835 GHz	2.4 GHz	Bluetooth	125 °C	-40 °C	Surface Mount	GFSK	2 Mbps	3.8 V	1.71 V	ADC GPIO I2C I2S IrDA PWM SPI UART	Chip Integrated	31-SMD Module	EFR32BG21	34.1 mA	16.1 mA	Bluetooth v5.3	10 dBm	9.1 mA	9.9 mA	96 kB	Flash RAM SRAM	96 kB	1 MB	-104.5 dBm
SILICON LABS BGM210PA32JIA2R	2.4835 GHz	2.4 GHz	Bluetooth	125 °C	-40 °C	Surface Mount	GFSK	2 Mbps	3.8 V	1.71 V	ADC GPIO I2C I2S IrDA PWM SPI UART	Chip Integrated	31-SMD Module	EFR32BG21	173 mA	59.7 mA	Bluetooth v5.3	20 dBm	9.1 mA	9.9 mA	96 kB	Flash RAM SRAM	96 kB	1 MB	-104.5 dBm
SILICON LABS BGM210P022JIA2R	2.4835 GHz	2.4 GHz	Bluetooth	125 °C	-40 °C	Surface Mount	GFSK	2 Mbps	3.8 V	1.8 V	ADC GPIO I2C I2S IrDA PWM SPI UART	Chip Integrated	31-SMD Module	EFR32BG21	34.1 mA	16.1 mA	Bluetooth v5.1	10 dBm	9.1 mA	9.9 mA	96 kB	Flash RAM SRAM	96 kB	1 MB	-104.5 dBm
SILICON LABS BGM210PB32JIA2	2.4835 GHz	2.4 GHz	Bluetooth	125 °C	-40 °C	Surface Mount	GFSK	2 Mbps	3.8 V	1.71 V	ADC GPIO I2C I2S IrDA PWM SPI UART	Chip Integrated	31-SMD Module	EFR32BG21	173 mA	59.7 mA	Bluetooth v5.3	20 dBm	9.1 mA	9.9 mA	96 kB	Flash RAM SRAM	96 kB	1 MB	-104.5 dBm
SILICON LABS BGM210PB22JIA2	2.4835 GHz	2.4 GHz	Bluetooth	125 °C	-40 °C	Surface Mount	GFSK	2 Mbps	3.8 V	1.71 V	ADC GPIO I2C I2S IrDA PWM SPI UART	Chip Integrated	31-SMD Module	EFR32BG21	34.1 mA	16.1 mA	Bluetooth v5.3	10 dBm	9.1 mA	9.9 mA	96 kB	Flash RAM SRAM	96 kB	1 MB	-104.5 dBm
SILICON LABS BGM210P032JIA2	2.4835 GHz	2.4 GHz	Bluetooth	125 °C	-40 °C	Surface Mount	GFSK	2 Mbps	3.8 V	1.71 V	ADC GPIO I2C I2S IrDA PWM SPI UART	Chip Integrated	31-SMD Module	EFR32BG21	173 mA	59.7 mA	Bluetooth v5.1	20 dBm	9.1 mA	9.9 mA	96 kB	Flash RAM SRAM	96 kB	1 MB	-104.5 dBm
SILICON LABS BGM210PA22JIA2R	2.4835 GHz	2.4 GHz	Bluetooth	125 °C	-40 °C	Surface Mount	GFSK	2 Mbps	3.8 V	1.71 V	ADC GPIO I2C I2S IrDA PWM SPI UART	Chip Integrated	31-SMD Module	EFR32BG21	34.1 mA	16.1 mA	Bluetooth v5.3	10 dBm	9.1 mA	9.9 mA	96 kB	Flash RAM SRAM	96 kB	1 MB	-104.5 dBm

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

BGM210P032JIA2 | Datasheet