Specification	XCZU4EV-1SFVC784I

Architecture	FPGA, MCU
Connectivity	USART, SD, USB OTG, CANbus, MMC, EBI, UART, Ethernet, SPI, I2C, SDIO, EMI
Core Processor	Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM Mali™-400 MP2, Dual ARM®Cortex™-R5 with CoreSight™
Operating Temperature (Max)	100 °C
Operating Temperature (Min)	-40 °C
Package / Case	FCBGA, 784-BFBGA
Package Length	23 mm
Package Name	784-FCBGA
Package Width	23 mm
Peripherals	WDT, DMA
Primary Attributes	Zynq®UltraScale+™ FPGA, 192K+ Logic Cells
RAM Size	256 KB
Speed	500 MHz, 600 MHz, 1.2 GHz

XCZU4EV Series

Part	RAM Size	Primary Attributes	Operating Temperature (Max)	Operating Temperature (Min)	Architecture	Speed	Connectivity	Package Width	Package Name	Package Length	Package / Case	Core Processor	Peripherals
AMD / Xilinx XCZU4EV-1SFVC784I	256 KB	192K+ Logic Cells Zynq®UltraScale+™ FPGA	100 °C	-40 °C	FPGA MCU	1.2 GHz 500 MHz 600 MHz	CANbus EBI EMI Ethernet I2C MMC SD SDIO SPI UART USART USB OTG	23 mm	784-FCBGA	23 mm	784-BFBGA FCBGA	ARM Mali™-400 MP2 Dual ARM®Cortex™-R5 with CoreSight™ Quad ARM® Cortex®-A53 MPCore™ with CoreSight™	DMA WDT

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