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EFR32MG21B010F768IM32-B

EFR32MG21B010F768IM32-B

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SILICON LABS

RF SYSTEM ON A CHIP - SOC MIGHTY GECKO, QFN32, 2.4G, 10DB, MESH MULTIPROTOCOL, 768KB, 64KB(RAM), 20 GPIO

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EFR32MG21B010F768IM32-B

EFR32MG21B010F768IM32-B

Active
SILICON LABS

RF SYSTEM ON A CHIP - SOC MIGHTY GECKO, QFN32, 2.4G, 10DB, MESH MULTIPROTOCOL, 768KB, 64KB(RAM), 20 GPIO

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Description

General part information

EFR32MG21B010 Series

IC RF TxRx + MCU 802.15.4, Bluetooth Bluetooth v5.1, Thread, Zigbee® 2.4GHz ~ 2.4835GHz 32-VFQFN Exposed Pad

Technical Specifications

Parameters and characteristics for this part

SpecificationEFR32MG21B010F768IM32-B
Current - Receiving (Max)9.8 mA
Current - Receiving (Min)8.8 mA
Current - Transmitting (Max)185 mA
Current - Transmitting (Min)9.3 mA
Data Rate (Max)2 MBaud
Frequency (Max)2.4835 GHz
Frequency (Min)2.4 GHz
GPIO Count20
Memory Size (Flash)768 kB
Memory TypeFlash, RAM
ModulationDSSS, O-QPSK, GFSK
Mounting TypeSurface Mount
Operating Temperature (Max)125 °C
Operating Temperature (Min)-40 °C
Package / Case32-VFQFN Exposed Pad
Package Length4 mm
Package Name32-QFN
Package Width4 mm
Power - Output10 dBm
ProtocolZigbee®, Bluetooth v5.1, Thread
RF Family/Standard802.15.4, Bluetooth
Sensitivity-104.9 dBm
Serial InterfacesUSART, I2C, I2S, UART, SPI, IrDA
TypeTxRx + MCU
Voltage - Supply (Maximum)3.8 V
Voltage - Supply (Minimum)1.71 V

Pricing

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CAD

3D models and CAD resources for this part