PCMF1USB3B/CZ

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Nexperia USA Inc.

COMMON-MODE EMI FILTER FOR DIFFERENTIAL CHANNELS WITH INTEGRATED BIDIRECTIONAL ESD PROTECTION

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PCMF1USB3B/CZ

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Nexperia USA Inc.

COMMON-MODE EMI FILTER FOR DIFFERENTIAL CHANNELS WITH INTEGRATED BIDIRECTIONAL ESD PROTECTION

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Description Specifications Series Pricing CAD Documents

Description

General part information

PCMF1USB3 Series

Common-mode ElectroMagnetic Interference (EMI) filters with integrated bidirectional ElectroStatic Discharge (ESD) protection for one, two and three differential channels. The devices are designed to provide low insertion loss for differential high-speed signals on each channel while unwanted common-mode signals are attenuated.

Technical Specifications

Parameters and characteristics for this part

Specification	PCMF1USB3B/CZ

DC Resistance (DCR) (Max)	3 Ohm
DC Resistance (DCR) (Typ)	3 Ohm
Features	TVS Diode ESD Protection
Filter Type	Signal Line
Height (Max)	0.024 in
Mounting Type	Surface Mount
Number of Lines	2
Operating Temperature (Max)	85 °C
Operating Temperature (Min)	-40 °C
Package / Case	WLCSP, 5-UFBGA
Size / Dimension Length	0.046 in
Size / Dimension Width	0.03 in

PCMF1USB3 Series

Common-mode EMI filter for differential channels with integrated bidirectional ESD protection

Part	Package / Case	Operating Temperature (Min)	Operating Temperature (Max)	Size / Dimension Width	Size / Dimension Length	DC Resistance (DCR) (Typ)	DC Resistance (DCR) (Max)	Mounting Type	Features	Height (Max)	Filter Type	Number of Lines
Nexperia USA Inc. PCMF1USB3B/CZ	5-UFBGA WLCSP	-40 °C	85 °C	0.03 in	0.046 in	3 Ohm	3 Ohm	Surface Mount	TVS Diode ESD Protection	0.024 in	Signal Line	2
Nexperia USA Inc. PCMF1USB3S/CZ	5-UFBGA WLCSP	-40 °C	85 °C	0.03 in	0.046 in	3 Ohm	3 Ohm	Surface Mount	TVS Diode ESD Protection	0.024 in	Signal Line	2
Nexperia USA Inc. PCMF1USB3BA/CZ		-40 °C	125 °C	0.03 in	0.046 in	2.6 Ohm	2.6 Ohm	Surface Mount	TVS Diode ESD Protection	0.025 in	Signal Line	2

Pricing

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CAD

3D models and CAD resources for this part

Documents

Technical documentation and resources

Datasheet

Nexperia Integrated CMF and ESD protection for high-speed data lines CN

wafer level chip-size package; 5 bumps (2-1-2); 0.4 mm pitch; 0.77 x 1.17 x 0.57 mm body

Nexperia package poster

wafer level chip-size package; 5 bumps (2-1-2)

CMF with ESD protection for high-speed data communication lines

High-speed interfaces - ESD protection and EMI filtering

Datasheet