TFM-115-01-H-D-RE2-WT

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Samtec Inc.

CONN HEADER R/A 30POS 1.27MM

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TFM-115-01-H-D-RE2-WT

Active

Samtec Inc.

CONN HEADER R/A 30POS 1.27MM

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Technical Specifications

Parameters and characteristics for this part

Specification	TFM-115-01-H-D-RE2-WT

Connector Type	Elevated, Header
Contact Finish - Mating	Gold
Contact Finish - Post	Gold
Contact Finish Thickness - Mating	30 Áin
Contact Finish Thickness - Mating	0.76 Ám
Contact Finish Thickness - Post	3 µin
Contact Finish Thickness - Post	0.076 µm
Contact Length - Mating	0.139 in
Contact Length - Mating	3.53 mm
Contact Length - Post	2.79 mm
Contact Length - Post [x]	0.11 in
Contact Material	Phosphor Bronze
Contact Shape	Square
Contact Type	Male Pin
Current Rating (Amps)	3.2 A, 2.9 A
Fastening Type	Push-Pull
Features	Solder Retention
Insulation Color	Black
Insulation Height	0.24 in
Insulation Height	6.1 mm
Insulation Material	Liquid Crystal Polymer (LCP)
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole, Right Angle
Number of Positions	30
Number of Positions Loaded	All
Number of Rows	2
Operating Temperature [Max]	125 °C
Operating Temperature [Min]	-55 °C
Pitch - Mating	0.05 in
Pitch - Mating	1.27 mm
Row Spacing - Mating	0.05 in
Row Spacing - Mating	1.27 mm
Shrouding	Shrouded - 4 Wall
Style	Board to Board, Cable
Termination	Solder
Voltage Rating	275 VAC

TFM-115 Series

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Part	Operating Temperature [Min]	Operating Temperature [Max]	Number of Rows	Connector Type	Material Flammability Rating	Insulation Height	Insulation Height	Contact Material	Pitch - Mating	Pitch - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Shape	Row Spacing - Mating	Row Spacing - Mating	Insulation Material	Contact Type	Shrouding	Contact Length - Mating	Contact Length - Mating	Insulation Color	Mounting Type	Current Rating (Amps)	Number of Positions Loaded	Contact Finish - Post	Contact Finish - Mating	Features	Number of Positions	Style	Voltage Rating	Termination	Fastening Type	Contact Length - Post	Contact Length - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Length - Post [x]
Samtec Inc. TFM-115-22-L-D-P	-55 °C	125 °C	2	Header	UL94 V-0	9.14 mm	0.36 in	Phosphor Bronze	0.05 in	1.27 mm	15 µin	0.38 µm	Square	0.05 in	1.27 mm	Liquid Crystal Polymer (LCP)	Male Pin	Shrouded - 4 Wall	0.139 in	3.53 mm	Black	Surface Mount	2.9 A	All	Tin	Gold	Pick and Place	30	Board to Board Cable	275 VAC	Solder	Push-Pull
Samtec Inc. TFM-115-32-S-D-K	-55 °C	125 °C	2	Header	UL94 V-0	11.05 mm	0.435 in	Phosphor Bronze	0.05 in	1.27 mm	30 Áin	0.76 Ám	Square	0.05 in	1.27 mm	Liquid Crystal Polymer (LCP)	Male Pin	Shrouded - 4 Wall	0.139 in	3.53 mm	Black	Surface Mount	2.9 A	All	Tin	Gold	Pick and Place	30	Board to Board Cable	275 VAC	Solder	Push-Pull
Samtec Inc. TFM-115-22-L-D-LC	-55 °C	125 °C	2	Header	UL94 V-0	9.14 mm	0.36 in	Phosphor Bronze	0.05 in	1.27 mm	15 µin	0.38 µm	Square	0.05 in	1.27 mm	Liquid Crystal Polymer (LCP)	Male Pin	Shrouded - 4 Wall	0.139 in	3.53 mm	Black	Surface Mount	2.9 A	All	Tin	Gold		30	Board to Board Cable	275 VAC	Solder	Push-Pull
Samtec Inc. TFM-115-32-L-D-A-K	-55 °C	125 °C	2	Header	UL94 V-0	11.05 mm	0.435 in	Phosphor Bronze	0.05 in	1.27 mm	15 µin	0.38 µm	Square	0.05 in	1.27 mm	Liquid Crystal Polymer (LCP)	Male Pin	Shrouded - 4 Wall	0.139 in	3.53 mm	Black	Surface Mount	3.2 A	All	Tin	Gold	Board Guide Pick and Place	30	Board to Board Cable	275 VAC	Solder	Push-Pull
Samtec Inc. TFM-115-32-L-D-LC-K-TR	-55 °C	125 °C	2	Header	UL94 V-0	11.05 mm	0.435 in	Phosphor Bronze	0.05 in	1.27 mm	15 µin	0.38 µm	Square	0.05 in	1.27 mm	Liquid Crystal Polymer (LCP)	Male Pin	Shrouded - 4 Wall	0.139 in	3.53 mm	Black	Surface Mount	2.9 A	All	Tin	Gold	Board Lock Pick and Place	30	Board to Board Cable	275 VAC	Solder	Push-Pull
Samtec Inc. TFM-115-02-L-D-LC-K-TR	-55 °C	125 °C	2	Header	UL94 V-0	5.6 mm	0.22 in	Phosphor Bronze	0.05 in	1.27 mm	15 µin	0.38 µm	Square	0.05 in	1.27 mm	Liquid Crystal Polymer (LCP)	Male Pin	Shrouded - 4 Wall	0.131 in	3.33 mm	Black	Surface Mount	2.9 A	All	Tin	Gold	Board Lock Pick and Place	30	Board to Board Cable	275 VAC	Solder	Push-Pull
Samtec Inc. TFM-115-31-S-D-P	-55 °C	125 °C	2	Header	UL94 V-0	11.05 mm	0.435 in	Phosphor Bronze	0.05 in	1.27 mm	30 Áin	0.76 Ám	Square	0.05 in	1.27 mm	Liquid Crystal Polymer (LCP)	Male Pin	Shrouded - 4 Wall	0.139 in	3.53 mm	Black	Through Hole	3.2 A	All	Tin	Gold	Pick and Place	30	Board to Board Cable	275 VAC	Solder	Push-Pull	2.03 mm	0.08 in
Samtec Inc. TFM-115-32-S-D-A-K-TR	-55 °C	125 °C	2	Header	UL94 V-0	11.05 mm	0.435 in	Phosphor Bronze	0.05 in	1.27 mm	30 Áin	0.76 Ám	Square	0.05 in	1.27 mm	Liquid Crystal Polymer (LCP)	Male Pin	Shrouded - 4 Wall	0.139 in	3.53 mm	Black	Surface Mount	2.9 A	All	Tin	Gold	Board Guide Pick and Place	30	Board to Board Cable	275 VAC	Solder	Push-Pull
Samtec Inc. TFM-115-01-H-D-RE2-WT	-55 °C	125 °C	2	Elevated Header	UL94 V-0	6.1 mm	0.24 in	Phosphor Bronze	0.05 in	1.27 mm	30 Áin	0.76 Ám	Square	0.05 in	1.27 mm	Liquid Crystal Polymer (LCP)	Male Pin	Shrouded - 4 Wall	0.139 in	3.53 mm	Black	Through Hole Right Angle	2.9 A 3.2 A	All	Gold	Gold	Solder Retention	30	Board to Board Cable	275 VAC	Solder	Push-Pull	2.79 mm		3 µin	0.076 µm	0.11 in
Samtec Inc. TFM-115-12-S-D-K-TR	-55 °C	125 °C	2	Header	UL94 V-0	7.37 mm	0.29 in	Phosphor Bronze	0.05 in	1.27 mm	30 Áin	0.76 Ám	Square	0.05 in	1.27 mm	Liquid Crystal Polymer (LCP)	Male Pin	Shrouded - 4 Wall	0.139 in	3.53 mm	Black	Surface Mount	2.9 A	All	Tin	Gold	Pick and Place	30	Board to Board Cable	275 VAC	Solder	Push-Pull

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tube	1	$ 6.76
		21	$ 6.34

Description

General part information

TFM-115 Series

Connector Header Through Hole, Right Angle 30 position 0.050" (1.27mm)

Documents

Technical documentation and resources

No documents available